METHOD FOR MANUFACTURING PATTERN-FORMED BODY
    1.
    发明申请
    METHOD FOR MANUFACTURING PATTERN-FORMED BODY 审中-公开
    制造图案形状的方法

    公开(公告)号:US20160124305A1

    公开(公告)日:2016-05-05

    申请号:US14897478

    申请日:2014-06-06

    Abstract: To provide a production method of a pattern-formed body, which can simply provide a pattern with surface free energy differences. A cured resin layer, to which a pattern of a master (20) has been transferred, is formed on a base (11), by applying a resin composition (12) containing a first compound exhibiting low surface free energy, and a second compound exhibiting surface free energy higher than the surface free energy of the first compound, on the base (11), and curing the resin composition (12) with bringing the resin composition into contact with a master (20), to which a pattern has been formed with surface free energy differences.

    Abstract translation: 为了提供一种能够简单地提供具有表面自由能差的图案的图案形成体的制造方法。 通过涂布含有表现出低表面自由能的第一化合物的树脂组合物(12)和第二化合物(12),在基材(11)上形成已经转印了母料(20)的图案的固化树脂层 在基体(11)上表现出比第一化合物的表面自由能高的表面自由能,并且使树脂组合物与已经形成图案的母料(20)接触来固化树脂组合物(12) 形成表面自由能差异。

    WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD

    公开(公告)号:US20190159345A1

    公开(公告)日:2019-05-23

    申请号:US15735772

    申请日:2016-06-22

    Abstract: A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m2.

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