公开(公告)号：US20240186153A1

公开(公告)日：2024-06-06

申请号：US18438158

申请日：2024-02-09

Applicant: DOOSAN CORPORATION

Inventor： Taejin CHOI ,  Chunggu Lee ,  Sooin Park ,  Jungjin lee

IPC: H01L21/56 ,  C09J7/38 ,  C09J7/40 ,  C09J163/00 ,  H01L23/00

CPC classification number: H01L21/563 ,  C09J7/38 ,  C09J7/405 ,  C09J163/00 ,  H01L24/92 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2467/005 ,  H01L2224/92125

Abstract: An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.

公开(公告)号：US11942336B2

公开(公告)日：2024-03-26

申请号：US17404009

申请日：2021-08-17

Applicant: DOOSAN CORPORATION

Inventor： Taejin Choi ,  Chunggu Lee ,  Sooin Park ,  Jungjin Lee

IPC: H01L21/56 ,  C09J7/38 ,  C09J7/40 ,  C09J163/00 ,  H01L23/00

CPC classification number: H01L21/563 ,  C09J7/38 ,  C09J7/405 ,  C09J163/00 ,  H01L24/92 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2467/005 ,  H01L2224/92125

Abstract: An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.