公开(公告)号：US20240336051A1

公开(公告)日：2024-10-10

申请号：US18745644

申请日：2024-06-17

申请人： Rapiscan Systems, Inc.

发明人： Evgeniy Kuksin ,  Neal Hartsough ,  William C. Barber

IPC分类号： B32B37/12 ,  B32B3/26 ,  B32B7/14 ,  B32B37/18 ,  C09J5/06 ,  C09J7/35 ,  C09J9/02 ,  C09J163/00 ,  C09J183/04 ,  H01L23/00 ,  H01L27/146

CPC分类号： B32B37/1292 ,  B32B3/266 ,  B32B7/14 ,  B32B37/1207 ,  B32B37/18 ,  C09J5/06 ,  C09J7/35 ,  C09J9/02 ,  C09J163/00 ,  C09J183/04 ,  H01L24/29 ,  H01L24/83 ,  H01L27/1463 ,  H01L27/14683 ,  B32B2305/72 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2309/025 ,  B32B2457/14 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2483/00 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/83862

摘要： A method of attaching a detector onto a substrate that has an array of electrically conducting pads is provided, together with the resulting detector assembly. The method includes pouring a non-conductive adhesive material over a substrate surface, allowing the adhesive to settle between the conducting pads to form dams around the conducting pads, applying a conductive adhesive material onto the conducting pads of the substrate, and placing a surface of the detector on the substrate surface over the conducting and non-conducting adhesives to thereby attach the surface of the detector to the surface of the substrate.

公开(公告)号：US20240327688A1

公开(公告)日：2024-10-03

申请号：US18617769

申请日：2024-03-27

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Naoyuki KUSHIHARA ,  Kazuaki SUMITA ,  Akira YAJIMA

IPC分类号： C09J163/00 ,  C08K3/36 ,  C08K5/00 ,  C08K5/3492 ,  C08K9/10 ,  C08L63/00

CPC分类号： C09J163/00 ,  C08K3/36 ,  C08K5/0025 ,  C08K5/3492 ,  C08K9/10 ,  C08L63/00 ,  C08L2203/20 ,  C08L2205/05 ,  C08L2312/04 ,  C09J2463/00

摘要： One of the objects of the present invention is to provide an epoxy resin composition that has excellent curability and storage stability, and that gives a cured product with excellent adhesive strength. The present invention provides an epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin in a form of liquid at 25° C., having, per molecule, one or more functional groups having an aliphatic carbon-carbon double bond, (C) a microcapsule-type curing accelerator, (D) an imidazole compound having a triazine ring, and (E) an inorganic filler.

公开(公告)号：US12098306B2

公开(公告)日：2024-09-24

申请号：US17262431

申请日：2019-07-25

申请人： LG Chem, Ltd.

发明人： Min Jin Ko ,  Jae Ho Jung ,  Min A Yu ,  Min Kyoun Kim ,  Byung Kyu Cho ,  Taek Yong Lee ,  Dong Yong Kim

IPC分类号： C09J163/00 ,  B32B27/38 ,  B32B27/40 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/48 ,  C08G18/67 ,  C08G18/75 ,  C08G59/24 ,  C08G59/40 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J163/04 ,  C09J175/08

CPC分类号： C09J163/04 ,  C08F212/08 ,  C08F220/14 ,  C08F236/06 ,  C08G18/10 ,  C08G18/24 ,  C08G18/4825 ,  C08G18/6715 ,  C08G18/755 ,  C08G59/245 ,  C08G59/4021 ,  C08L51/04 ,  C09J11/08 ,  C09J151/04 ,  C09J175/08 ,  C08L2201/08 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2205/18 ,  C08L2207/53 ,  C09J2301/30 ,  C09J2301/414 ,  C09J2451/00 ,  C09J2463/00 ,  C09J2475/00

摘要： An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

公开(公告)号：US20240287360A1

公开(公告)日：2024-08-29

申请号：US18649929

申请日：2024-04-29

申请人： AJINOMOTO CO., INC.

发明人： Kenji KAWAI

IPC分类号： C09J163/00 ,  B32B5/02 ,  B32B15/09 ,  B32B27/12 ,  B32B27/36 ,  C08L63/00 ,  C09J7/25 ,  C09J7/29 ,  C09J7/35 ,  H05K1/03

CPC分类号： C09J163/00 ,  B32B5/02 ,  B32B15/09 ,  B32B27/12 ,  B32B27/36 ,  C08L63/00 ,  C09J7/255 ,  C09J7/29 ,  C09J7/35 ,  H05K1/0326 ,  H05K1/0366 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2457/08 ,  C08L2203/20 ,  C09J2400/163 ,  C09J2463/00 ,  C09J2467/006

摘要： Resin compositions including: (A) a naphthol aralkyl type epoxy resin having a weight-average molecular weight (Mw) of 1,000 or more and an epoxy equivalent of 350 g/eq. or more; and (B) a curing agent, in which (B) the curing agent includes an active ester type curing agent are useful for preparing cured products, sheet lamination materials, resin sheets, printed wiring boards, and semiconductor devices, and for methods for producing printed wiring boards or semiconductor devices.

公开(公告)号：US12061946B2

公开(公告)日：2024-08-13

申请号：US17890206

申请日：2022-08-17

申请人： Trackonomy Systems, Inc.

发明人： Ajay Khoche

IPC分类号： G06K19/077 ,  B32B37/06 ,  B32B37/12 ,  C09J7/38 ,  G06K19/06 ,  G06K19/07 ,  H04W4/029 ,  H04W4/02

CPC分类号： G06K19/07773 ,  B32B37/06 ,  B32B37/12 ,  C09J7/38 ,  G06K19/06037 ,  G06K19/0702 ,  H04W4/029 ,  B32B2457/00 ,  C09J2203/326 ,  C09J2301/124 ,  C09J2301/302 ,  C09J2301/40 ,  C09J2463/00 ,  H04W4/027

摘要： A low-cost, multi-function adhesive tape platform with a form factor that unobtrusively integrates one or more transducers and one or more wireless communication devices in an adhesive product system. In an aspect, the adhesive product system integrates transducer and wireless communication components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the constituent components but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including sensing, notification, security, and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.

公开(公告)号：US12049574B2

公开(公告)日：2024-07-30

申请号：US17697745

申请日：2022-03-17

申请人： PPG Industries Ohio, Inc.

发明人： Umesh C. Desai ,  Tien-Chieh Chao ,  Masayuki Nakajima ,  Kaliappa G. Ragunathan

IPC分类号： C09J163/00 ,  B32B27/38 ,  B82Y30/00 ,  C08G59/06 ,  C08G59/18 ,  C08G59/20 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08G59/56 ,  C08L63/00 ,  C09J5/00 ,  C09J5/06 ,  C08K3/04

CPC分类号： C09J163/00 ,  B82Y30/00 ,  C08G59/066 ,  C08G59/182 ,  C08G59/184 ,  C08G59/4276 ,  C08G59/5006 ,  C08L63/00 ,  C09J5/00 ,  C09J5/06 ,  C08K3/04 ,  C08L2205/02 ,  C09J2463/00 ,  C08L63/00 ,  C08L21/00 ,  C08L63/00

摘要： Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

公开(公告)号：US20240240066A1

公开(公告)日：2024-07-18

申请号：US18574602

申请日：2022-06-24

申请人： TESA SE

发明人： Bastian KRUSKOP ,  Yvonne QUERDEL ,  Christian SCHUH ,  Nadine WEDEL

IPC分类号： C09J163/00 ,  C09J7/24 ,  C09J7/38 ,  C09J11/06 ,  C09J133/10

CPC分类号： C09J163/00 ,  C09J7/243 ,  C09J7/38 ,  C09J11/06 ,  C09J133/10 ,  C09J2301/124 ,  C09J2301/302 ,  C09J2301/408 ,  C09J2301/412 ,  C09J2400/24 ,  C09J2463/00

摘要： The invention relates to a curable adhesive tape which firstly can be easily positioned on a substrate prior to curing ml the form of a pressure-sensitive adhesive tape and after curing has extremely high adhesive strength and good shock resistance, and secondly can also be easily stamped into very narrow shapes. This is achieved with a reactive adhesive tape which comprises a film, a first outer reactive adhesive composition and a second outer reactive adhesive composition and is characterised in that at least one of the reactive adhesive compositions comprises at least one reactive component, at least one photoinitiator, one or more foaming agents and at least one polymer, and said reactive adhesive composition is foamed.

公开(公告)号：US20240218217A1

公开(公告)日：2024-07-04

申请号：US18525254

申请日：2023-11-30

申请人： SHENGYI TECHNOLOGY CO., LTD.

发明人： Jinchao DONG ,  Naidong SHE ,  Yanhua ZHANG ,  Junqi TANG

IPC分类号： C09J163/00 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  C09J7/30

CPC分类号： C09J163/00 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  C09J7/30 ,  C08K2201/005 ,  C08L2203/30 ,  C09J2400/10 ,  C09J2463/00 ,  C09J2467/005 ,  C09J2479/08

摘要： Thermosetting resin composition and insulating adhesive film. The thermosetting resin composition comprises 30-70 parts of epoxy resin, 5-500 parts of a modified spherical silica powder, and 30-70 parts of a curing agent; the modified spherical silica powder comprises an amino-modified spherical silica powder with a D50 particle size of 0.1-2.0 μm and a coefficient of variation of ≥35% in particle size distribution. By using modified spherical silica powder in epoxy resin system and controlling its D50 particle size and coefficient of variation in particle size distribution, the resin composition can reduce melt viscosity of high-filling system and achieve a low melt viscosity in an insulating adhesive film conducive to the filling of fine circuits. The resin composition for preparation of a build-up adhesive FC-BGA film of a high-filling system has strong bite-etching resistance, low surface roughness after Desmear treatment, high adhesive force with electroless copper and low dielectric loss.

公开(公告)号：US20240182752A1

公开(公告)日：2024-06-06

申请号：US18408917

申请日：2024-01-10

申请人： Zephyros, Inc.

发明人： Ira Miller ,  Michael Czaplicki ,  Michel Awkal

IPC分类号： C09J7/10 ,  C08J5/12 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/21 ,  C09J7/35 ,  C09J163/00 ,  C09J171/00

CPC分类号： C09J7/10 ,  C08J5/128 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/21 ,  C09J7/35 ,  C08J2363/00 ,  C08J2367/00 ,  C08J2463/00 ,  C09J163/00 ,  C09J171/00 ,  C09J2301/122 ,  C09J2301/124 ,  C09J2301/414 ,  C09J2451/00 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2463/006 ,  C09J2467/006 ,  C09J2471/00 ,  C09J2477/006 ,  C09J2479/086 ,  Y10T428/1476 ,  Y10T428/31515

摘要： Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces. the materials are particularly useful in bonding together dissimilar substrates.

公开(公告)号：US20240124749A1

公开(公告)日：2024-04-18

申请号：US17966220

申请日：2022-10-14

申请人： tesa SE

发明人： Kerstin KLINGEBERG ,  Olga KIRPICENOK ,  Hans-Peter GRAEF ,  Philipp WEGENER ,  Gerhard BIR

IPC分类号： C09J7/38 ,  B32B5/02 ,  B32B27/12 ,  C09J7/24 ,  C09J7/40

CPC分类号： C09J7/38 ,  B32B5/022 ,  B32B5/024 ,  B32B27/12 ,  C09J7/243 ,  C09J7/401 ,  B32B27/32 ,  C09J2203/302 ,  C09J2463/00

摘要： The invention relates to an adhesive tape for jacketing elongated items such as more particularly leads or cable sets, comprising a tapelike carrier provided on at least one side with a curable adhesive, characterized in that the adhesive tape is further provided on one side of the tapelike carrier with a release layer of carbamate.