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公开(公告)号：US20220017794A1
公开(公告)日：2022-01-20
申请号：US17418445
申请日：2019-08-23
Applicant: DOOSAN CORPORATION
Inventor： Taejin CHOI , Woojeong KIM
IPC: C09J11/04 , C09J163/00 , C09J11/06 , H01L23/00
Abstract: A non-conductive adhesive film for semiconductor packages and a method of manufacturing a semiconductor package using the non-conductive adhesive film are disclosed. The non-conductive adhesive film for semiconductor packages includes a base; and an adhesive layer disposed on one surface of the base and having a storage modulus in a range of 2 to 4 GPa at 25° C.
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