公开(公告)号：US5966194A

公开(公告)日：1999-10-12

申请号：US605958

申请日：1996-02-23

申请人： Dyi-Chung Hu ,  Sheng-Heisn Lin ,  Tai-Kang Wu ,  Sywe N. Lee

发明人： Dyi-Chung Hu ,  Sheng-Heisn Lin ,  Tai-Kang Wu ,  Sywe N. Lee

IPC分类号： G02F1/1339 ,  G02F1/1345

CPC分类号： G02F1/1339 ,  G02F1/13392 ,  G02F1/1345

摘要： The display area of a liquid crystal display cell is increased by placing conductive epoxy within the boundary which seals the liquid crystal to connect the top glass plate with the bottom glass plate, in contrast with the conventional method of making the electrical connection outside the display area. The conductive epoxy is dispensed in areas not occupied by the liquid crystal patterns. The conductive epoxy can be in the form of particles of spheres or rods serving as spacers for maintaining the gap dimension between the two glass plates. The conductive epoxy can also be integrated with the boundary sealing epoxy or fill a notch cut in the boundary sealing epoxy.

摘要翻译： 通过将导电环氧树脂放置在密封液晶的边界内以将顶部玻璃板与底部玻璃板连接起来来增加液晶显示单元的显示区域，与将显示区域外的电连接的传统方法相反， 。 导电环氧树脂被分配在未被液晶图案占据的区域中。 导电环氧树脂可以是用作保持两个玻璃板之间的间隙尺寸的间隔物的球体或棒的颗粒形式。 导电环氧树脂也可以与边界密封环氧树脂一体化，或填充边界密封环氧树脂中的切口。

公开(公告)号：US6099786A

公开(公告)日：2000-08-08

申请号：US605953

申请日：1996-02-23

申请人： Dyi-Chung Hu ,  Sheng-Heisn Lin ,  Tai-Kang Wu ,  Sywe N. Lee

发明人： Dyi-Chung Hu ,  Sheng-Heisn Lin ,  Tai-Kang Wu ,  Sywe N. Lee

IPC分类号： G02F1/1337 ,  G02F1/1339 ,  B29D11/00

CPC分类号： G02F1/1339 ,  G02F1/133711 ,  Y10T428/1005

摘要： A method of making accurate alignment layers in a liquid crystal display (LCD) cell is provided so that the LCD seal band can be placed as close to the pixel as possible. This method is implemented by ablating the apolyimide film on the glass substrates of the LCD cell to remove the alignment film where the sealing material is to be dispersed later. Thus, the sealing band can butt against the liquid crystal mixture without any clearance. In so doing, the display area is increased, and the reliability of the seal is improved.

摘要翻译： 提供了一种在液晶显示器（LCD）单元中制作精确对准层的方法，使得LCD密封带可以尽可能靠近像素放置。 该方法通过在LCD单元的玻璃基板上烧蚀聚酰亚胺膜以去除密封材料稍后分散的取向膜来实现。 因此，密封带可以无间隙地对着液晶混合物。 这样做，显示区域增加，并且提高了密封的可靠性。

公开(公告)号：US6018380A

公开(公告)日：2000-01-25

申请号：US922259

申请日：1997-09-02

申请人： Dyi-Chung Hu ,  Hung-Ming Lee ,  Tai-Kang Wu ,  Sywe N. Lee ,  Sheng-Heisn Lin ,  Ching-Chung Tsai ,  Hung-Chien Kuo ,  Chung-Jen Chen

发明人： Dyi-Chung Hu ,  Hung-Ming Lee ,  Tai-Kang Wu ,  Sywe N. Lee ,  Sheng-Heisn Lin ,  Ching-Chung Tsai ,  Hung-Chien Kuo ,  Chung-Jen Chen

IPC分类号： G02F1/1339 ,  G02F1/1333

CPC分类号： G02F1/1339 ,  G02F1/13392

摘要： A liquid crystal display device having a sealing material close to display area while maintaining a uniform liquid crystal cell gap is disclosed. The liquid crystal display comprises two transparent electrode substrates having a trench near the display area to stop the sealing material overflowing to display pixels. Thus, the effective display area of a liquid crystal display device is increased by dispensing a sealing material to a trench area at a predetermined position surrounding the display area. A spacer used in the sealing material is larger in size than that used in the display area to compensate the depth of the trench. After the liquid crystal is injected into the space surrounded by the substrates and a sealing material, a uniform liquid crystal cell gap over the entire display area is obtained. The liquid crystal display device thus obtained results in a closer distance between the sealing material and display area without any unevenness in color over the entire display area, and lends itself very useful as unit display device or as one of the panels in a tiled liquid crystal display device.

摘要翻译： 公开了一种在保持均匀的液晶单元间隙的同时具有接近显示区域的密封材料的液晶显示装置。 液晶显示器包括在显示区域附近具有沟槽的两个透明电极基板，以阻止密封材料溢出以显示像素。 因此，通过在围绕显示区域的预定位置处的沟槽区域分配密封材料来增加液晶显示装置的有效显示区域。 在密封材料中使用的间隔物的尺寸大于在显示区域中使用的间隔物，以补偿沟槽的深度。 在将液晶注入到由基板和密封材料包围的空间中之后，在整个显示区域上获得均匀的液晶单元间隙。 这样得到的液晶显示装置使得密封材料与显示区域之间的距离更远，而在整个显示区域上的颜色不均匀，并且其本身作为单元显示装置或作为平铺液晶中的一个面板非常有用 显示设备。

公开(公告)号：US5619223A

公开(公告)日：1997-04-08

申请号：US227716

申请日：1994-04-14

申请人： Sywe N. Lee ,  Dyi-Chung Hu ,  Huann-Min Tang

发明人： Sywe N. Lee ,  Dyi-Chung Hu ,  Huann-Min Tang

IPC分类号： G09G3/00 ,  G09G3/36 ,  G11C29/00 ,  G11C29/02 ,  G11C29/50 ,  G09G5/00

CPC分类号： G11C29/78 ,  G09G3/3677 ,  G09G2330/08 ,  G09G3/006 ,  G11C29/02 ,  G11C29/50 ,  Y10S345/904

摘要： A redundant row select driver circuit system is provided for enhancing manufacturing yield and reducing manufacturing costs in the liquid crystal data displays. In particular, a row select driver circuit is provided with redundant subcircuits that can effectively replace any damaged subcircuit within the row select driver circuit. In addition, there is disclosed a capacitance compensating scheme to adjust the gray scale level in a damaged row select line with a break inside the display area. And finally, an enhanced diagnostic scheme is disclosed for testing of each row select driver subcircuits in a active matrix display having row select driver circuits connected to each end of row select lines.

摘要翻译： 提供冗余行选择驱动器电路系统，用于提高液晶数据显示器的制造成品率并降低制造成本。 特别地，行选择驱动器电路具有冗余的子电路，其可以有效地替代行选择驱动器电路内的任何损坏的子电路。 此外，公开了一种电容补偿方案，以在损坏的行选择线中调整显示区域内的断点处的灰度级。 最后，公开了一种用于测试具有连接到行选择线的每一端的行选择驱动器电路的有源矩阵显示器中的每行选择驱动器子电路的增强诊断方案。

公开(公告)号：US5555001A

公开(公告)日：1996-09-10

申请号：US207759

申请日：1994-03-08

申请人： Sywe N. Lee ,  Huann-Min Tang ,  Dyi-Chung Hu

发明人： Sywe N. Lee ,  Huann-Min Tang ,  Dyi-Chung Hu

IPC分类号： G09G3/36

CPC分类号： G09G3/3688 ,  G02F1/136259 ,  G09G2310/0248 ,  G09G2310/0297 ,  G09G2330/08

摘要： An LCD display having at least one redundant data driving circuit on a substrate that can be substituted for a defective data driving circuit on the substrate. These redundant subcircuits are exact copies of a column driving subcircuit except that some of the connecting points to the control and driving signal lines are not hardwired. That is, the connecting points are left as potential welding points. If a column driving circuit that is coupled to a particular input data line is damaged, then a redundant data driving subcircuit can be hardwired by welding the corresponding crossing points to compensate the damaged circuit. The damaged circuit is also disconnected (by using a laser cut or compatible methods) from the corresponding input data line and the internal data line as necessary.

摘要翻译： 一种液晶显示器，其具有在基板上的至少一个冗余数据驱动电路，该冗余数据驱动电路可以代替基板上的有缺陷的数据驱动电路。 这些冗余子电路是列驱动分支电路的精确副本，除了一些到控制和驱动信号线的连接点不是硬连线。 也就是说，连接点作为潜在焊点留下。 如果耦合到特定输入数据线的列驱动电路被损坏，则通过焊接相应的交叉点来补偿损坏的电路，可以硬连线冗余数据驱动分支电路。 损坏的电路也根据需要从相应的输入数据线和内部数据线断开（通过使用激光切割或兼容方法）。

公开(公告)号：US10964580B2

公开(公告)日：2021-03-30

申请号：US15374622

申请日：2016-12-09

申请人： Dyi-Chung Hu

发明人： Dyi-Chung Hu

IPC分类号： B32B3/02 ,  B32B9/00 ,  H01L21/02 ,  H01L21/683 ,  B32B9/04 ,  B32B15/04 ,  B32B17/06 ,  B32B3/30 ,  B32B15/01 ,  B32B15/18 ,  B32B15/20 ,  G03F7/20 ,  H01L21/027 ,  H01L21/288

摘要： At least one wafer is embedded in a carrier to eliminate or at least reduce edge effect. The wafer reconfiguration is designed to improve a quality not only for spin coating process but also for electric plating process. An edge bead is formed on top of the carrier instead of being formed on top of the wafer so that a full top surface of the wafer can be active to the fabrication of chips and therefore more chips are yielded for a single wafer. The backside of the wafer is not contaminated by the coating according to the present invention. Further, dummy circuits can be made on top of the carrier so that electric plating uniformity for full area of a wafer can be improved.

公开(公告)号：US10395946B2

公开(公告)日：2019-08-27

申请号：US16177446

申请日：2018-11-01

申请人： Dyi-Chung Hu

发明人： Dyi-Chung Hu

IPC分类号： H01L23/49 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/538 ,  H01L23/31

摘要： A method for manufacturing an electronic package includes: forming a middle patterned conductive layer having a first surface, a second surface opposite to the first surface, and a plurality of middle conductive pads; forming a first redistribution circuitry on the first surface, wherein the first redistribution circuitry includes a first patterned conductive layer having a plurality of first conductive elements, each first conductive element has a first conductive via and pad that form a T-shaped section, and each first conductive via connects the corresponding middle conductive pad and is tapering; and forming a second redistribution circuitry on the second surface, wherein the second redistribution circuitry includes a second patterned conductive layer having a plurality of second conductive elements, each second conductive element has a second conductive via and pad that form an inversed T-shaped section, and each second conductive via connects the corresponding middle conductive pad and is tapering.

公开(公告)号：US10304794B2

公开(公告)日：2019-05-28

申请号：US15694858

申请日：2017-09-04

申请人： Dyi-Chung Hu

发明人： Dyi-Chung Hu

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L21/78 ,  H01L23/28 ,  H05K1/11 ,  H01L21/683 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065

摘要： A manufacturing method of an integrated circuit package including the following step is provided. A bottom redistribution layer according to IC design rule is fabricated. A top redistribution layer according to PCB design rule and using the first top pads as a starting point is fabricated. The bottom redistribution layer has a plurality of first bottom pads, a plurality of first top pads, at least one dielectric layer and a plurality of vias. Sides and the top of the bottom redistribution layer have interfaces with a lowermost dielectric layer of the top redistribution layer, a bottom surface of the lowermost dielectric layer opposite to the plurality of first top pads is coplanar with a bottom surface of the at least one dielectric layer opposite to the plurality of first top pads and surfaces of the plurality of first bottom pads exposed by the at least one dielectric layer.

公开(公告)号：US10049995B2

公开(公告)日：2018-08-14

申请号：US15708142

申请日：2017-09-19

申请人： Dyi-Chung Hu

发明人： Dyi-Chung Hu

IPC分类号： H01L21/44 ,  H01L23/00 ,  H01L25/065

摘要： A bonding film has at least a left longitudinal branch, and a lower latitudinal branch; a first bonding area is configured in a first branch, and a second bonding area is configured in a second branch. A plurality of outer top metal pads and a plurality of inner top metal pads are exposed on a top surface within each bonding area. A central chip is configured in a central area of the bonding film and is electrically coupled to the inner top metal pad, and at least two peripheral chips are configured neighboring to the central chip and electrically coupled to the outer top metal pads. Each of the inner top metal pads is electrically coupled to a corresponding outer top metal pad through an embedded circuitry. The central chip communicates with the peripheral chips through the inner top metal pad, embedded circuitry, and outer top metal pad of the bonding film.

公开(公告)号：US10002852B1

公开(公告)日：2018-06-19

申请号：US15380716

申请日：2016-12-15

申请人： Dyi-Chung Hu

发明人： Dyi-Chung Hu

IPC分类号： H01L21/02 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00

摘要： A first integrated circuit (IC) package has a package substrate on bottom. The package substrate comprises a bottom redistribution circuitry configured according to printed circuit board (PCB) design rule and a top redistribution circuitry configured according to integrated circuit (IC) design rule. The first IC package has a plurality of top metal pads and a plurality of copper pillars configured on a top side according to IC design rule. A second IC package has a plurality of bottom metal pads configured according to IC design rule configured on a top side of the first IC package. The first IC package electrically couples to the second IC package through the plurality of copper pillars.