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1.发明申请Electrical Component and Method for Establishing Contact with an Electrical Component 有权用于建立与电气部件接触的电气部件和方法公开(公告)号：US20150255237A1
公开(公告)日：2015-09-10
申请号：US14431726
申请日：2013-09-09
Applicant: EPCOS AG
Inventor： Marion Ottlinger , Robert Krumphals , Andreas Stani
CPC classification number: H01H57/00 , H01H45/14 , H01H49/00 , H01L41/0472 , H01L41/293
Abstract: An electrical component includes at least one external contact having a first metallization and a second metallization. The metallizations are fired and the second metallization only partly covers the first metallization. Furthermore, an electrical component includes at least one frame-shaped metallization. Furthermore, an electrical component includes a first and second metallization that have a different wettability with solder material.
Abstract translation: 电气部件包括具有第一金属化和第二金属化的至少一个外部接触。 金属化被烧制，第二金属化仅部分地覆盖第一金属化。 此外，电气部件包括至少一个框架状金属化。 此外，电气部件包括与焊料材料具有不同润湿性的第一和第二金属化。
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公开(公告)号：US09613773B2
公开(公告)日：2017-04-04
申请号：US14431726
申请日：2013-09-09
Applicant: EPCOS AG
Inventor： Marion Ottlinger , Robert Krumphals , Andreas Stani
IPC: H01L41/083 , H01H57/00 , H01L41/047 , H01L41/293 , H01H45/14 , H01H49/00
CPC classification number: H01H57/00 , H01H45/14 , H01H49/00 , H01L41/0472 , H01L41/293
Abstract: An electrical component includes at least one external contact having a first metallization and a second metallization. The metallizations are fired and the second metallization only partly covers the first metallization. Furthermore, an electrical component includes at least one frame-shaped metallization. Furthermore, an electrical component includes a first and second metallization that have a different wettability with solder material.
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