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公开(公告)号：US20230172070A1
公开(公告)日：2023-06-01
申请号：US17987660
申请日：2022-11-15
Applicant: SII Crystal Technology Inc.
Inventor： Tomohiro MOMOSE
IPC: H01L41/047 , H01L41/113 , H01L41/09 , H01L41/293
CPC classification number: H01L41/0472 , H01L41/1132 , H01L41/094 , H01L41/293 , H03B5/32
Abstract: There are provided an excitation electrode, a quartz crystal vibrator element, a quartz crystal vibrator, a sensor, an oscillator, and a method of manufacturing a quartz crystal vibrator element which are not affected by heat in a process or a use environment to surely prevent a frequency fluctuation from occurring, reduction in size of which can be achieved, and which are low in cost and excellent in productivity. The excitation electrodes are disposed on an outer surface of a quartz crystal plate, apply an electrical field for exciting the quartz crystal plate to the quartz crystal plate, have a single layer structure formed of a two-dimensional layered substance, and are used when arranged as a pair so as to be opposed to each other via the quartz crystal plate.
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公开(公告)号：US20190214545A1
公开(公告)日：2019-07-11
申请号：US16099207
申请日：2017-05-15
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： ROLAND ALEXANDER VAN DE MOLENGRAAF , MARK THOMAS JOHNSON , CORNELIS PETRUS HENDRIKS , DAAN ANTON VAN DEN ENDE
IPC: H01L41/193 , H01L41/04 , H02N2/06 , H01L41/047 , H01L41/09
CPC classification number: H01L41/193 , H01L41/042 , H01L41/0472 , H01L41/09 , H02N2/062
Abstract: The invention involves providing a reset signal before and or after one or more actuation signals to an electroactive polymer structure of an actuator. The reset signal can cause relaxation of defects such as e.g. trapped charge, dipoles and/or others in the EAP or EAP structure so that upon a subsequent activation using a drive signal, the initial actuation state is defined to be more constant than without use of the reset signal. Hence the actuation 5 output of a device employing the invention is more reproducible. The invention is applicable to actuator devices that have an electroactive polymer structure including an EAP material, where the structure is capable of providing a mechanical actuation upon subjection of at least part of the EAP material to an electrical drive signal.
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公开(公告)号：US20190131072A1
公开(公告)日：2019-05-02
申请号：US16166493
申请日：2018-10-22
Applicant: TDK CORPORATION
Inventor： Shinya ONODERA , Takehisa TAMURA , Atsushi TAKEDA , Ken MORITA
CPC classification number: H01G4/2325 , H01C1/148 , H01C7/008 , H01C7/18 , H01F17/0013 , H01F27/292 , H01G2/065 , H01G4/012 , H01G4/12 , H01G4/1227 , H01G4/1245 , H01G4/232 , H01G4/248 , H01G4/252 , H01G4/30 , H01L41/0472
Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. A first length of the element body in the first direction is different from a second length of the element body in the second direction. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces.
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4.发明申请公开(公告)号：US20190001681A1
公开(公告)日：2019-01-03
申请号：US15735884
申请日：2016-07-01
Applicant: Seiko Epson Corporation
Inventor： Yasuhide Matsuo , Kenji Otsuka , Hiroyuki Tsuchiya , Kei Tadachi , Wataru Takahashi
CPC classification number: B41J2/14209 , B41J2/14233 , B41J2/1607 , B41J2/161 , B41J2/1623 , B41J2002/14241 , B41J2002/14362 , H01L41/0472 , H01L41/1876
Abstract: An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.
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公开(公告)号：US10074483B2
公开(公告)日：2018-09-11
申请号：US15691833
申请日：2017-08-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuki Kurokawa , Hirobumi Adachi
CPC classification number: H01G4/30 , H01C1/14 , H01C7/008 , H01F17/0013 , H01F27/2804 , H01F27/29 , H01F27/292 , H01F2027/2809 , H01G4/0085 , H01G4/12 , H01G4/1227 , H01G4/248 , H01L41/0472 , H01L41/083 , H01L41/1876 , H01L41/297
Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.
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Patent Agency Ranking
公开(公告)号：US20180242949A1
公开(公告)日：2018-08-30
申请号：US15965385
申请日：2018-04-27
Applicant: VOLCANO CORPORATION
Inventor： Cheryl Rice , Dongjuan Chris Xi
CPC classification number: A61B8/4483 , A61B8/0891 , A61B8/12 , A61B8/445 , A61B8/4461 , B06B1/0662 , B06B1/0688 , H01L41/047 , H01L41/0472 , H01L41/0477 , H01L41/0825 , H01L41/0973 , H01L41/098 , H01L41/29 , H01L41/31 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49155
Abstract: The present disclosure provides a method of fabricating an ultrasound transducer. A substrate having a first side and a second side opposite the first side is provided. A bottom electrode is formed over the first side of the substrate. A piezoelectric element is formed over the bottom electrode. The piezoelectric element has a chamfered sidewall. A top electrode is formed over the piezoelectric element. A step metal element is formed over a portion of the top electrode proximate to the chamfered sidewall of the piezoelectric element.
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公开(公告)号：US09916933B2
公开(公告)日：2018-03-13
申请号：US15623757
申请日：2017-06-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuki Kurokawa , Hirobumi Adachi
IPC: H01L41/08 , H01G4/30 , H01L41/083 , H01F27/28 , H01G4/008 , H01C1/14 , H01C7/00 , H01F27/29 , H01G4/248 , H01L41/047 , H01L41/187 , H01L41/297 , H01G4/12
CPC classification number: H01G4/30 , H01C1/14 , H01C7/008 , H01F17/0013 , H01F27/2804 , H01F27/29 , H01F27/292 , H01F2027/2809 , H01G4/0085 , H01G4/12 , H01G4/1227 , H01G4/248 , H01L41/0472 , H01L41/083 , H01L41/1876 , H01L41/297
Abstract: A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.
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公开(公告)号：US20180053888A1
公开(公告)日：2018-02-22
申请号：US15674950
申请日：2017-08-11
Applicant: Seiko Epson Corporation
Inventor： Hironori SUZUKI , Hiroshi MATSUDA , Koji OHASHI
IPC: H01L41/053 , H01L41/04 , H01L41/311 , B06B1/06 , B06B1/02 , H01L41/047
CPC classification number: H01L41/0533 , B06B1/0207 , B06B1/0607 , B06B1/0622 , B06B1/0688 , B06B2201/55 , B06B2201/56 , H01L41/042 , H01L41/0472 , H01L41/0475 , H01L41/0477 , H01L41/0973 , H01L41/311
Abstract: A mounting structure includes a first substrate which has a first surface on which a functional element is provided, a second substrate that has a second surface facing the first surface, a wiring portion that is provided at a position which is different from a position of the functional element on the first surface, has a third surface facing the second surface, and is electrically connected to the functional element, and a conduction portion that is provided on the second surface, protrudes toward the first surface, and is connected to the third surface so as to be electrically connected to the functional element, in which an area of the third surface is larger than an area of a first end section of the wiring portion on the first substrate side in a plan view which is viewed from a thickness direction of the first substrate and the second substrate.
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公开(公告)号：US20180033556A1
公开(公告)日：2018-02-01
申请号：US15659682
申请日：2017-07-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Masakazu ITAMOCHI
IPC: H01G4/30 , H01G4/012 , H01G4/248 , H01F1/34 , H01L41/047 , H01L41/083 , H01C7/00 , H01G4/12 , H01L41/187
CPC classification number: H01G4/30 , H01C7/008 , H01F1/34 , H01F17/0013 , H01F27/292 , H01G4/012 , H01G4/1227 , H01G4/248 , H01L41/0471 , H01L41/0472 , H01L41/0477 , H01L41/083 , H01L41/1876
Abstract: A multilayer ceramic electronic component includes an electronic component body including a laminate and an external electrode, and a pair of metal terminals that are joined by a joining material. The pair of metal terminals includes a terminal joint portion, an extended portion and a mounting portion. The external electrode is provided only on both end surfaces of the laminate, and includes first and second external electrodes. The first external electrode and the second external electrode each include a saddle portion with a thickness larger than the thickness of a center portion of each end surface in the periphery of the first end surface and the second end surface of the laminate, respectively.
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公开(公告)号：US20180013056A1
公开(公告)日：2018-01-11
申请号：US15640747
申请日：2017-07-03
Applicant: TDK CORPORATION
Inventor： Yoshiki OHTA , Satoshi SASAKI , Yoshiaki OHTA , Takahiro KEZUKA , Katsuya INABA , Rin SATO , Kazushi TACHIMOTO , Masayoshi INOUE , Yuzo KOMATSU
IPC: H01L41/083
CPC classification number: H01L41/0838 , H01L41/0471 , H01L41/0472
Abstract: In a piezoelectric element, internal stress generated in an inactive portion at the time of sintering when a piezoelectric element is fabricated or stress applied from the outside to the inactive portion is absorbed by a recess of a lower surface of a first through hole conductor and a recess of an upper surface of a second through hole conductor. Accordingly, for example, deformation, rupture, or the like of the through hole conductor is prevented, and conduction failure or disconnection of an electrode layer or a through hole conductor is prevented. Further, in the inactive portion, since a protrusion of the piezoelectric layer enters the recess of the through hole conductor, a holding force of the piezoelectric layer with respect to the through hole conductor increases, and deformation of the through hole conductor is prevented or obstructed.
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