公开(公告)号：US11572469B2

公开(公告)日：2023-02-07

申请号：US17339566

申请日：2021-06-04

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien Hsu ,  Tse-Hung Liu ,  Tsan-Hung Tsai

IPC: C08K5/3492 ,  C08L71/12

Abstract: A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US12134682B2

公开(公告)日：2024-11-05

申请号：US17827449

申请日：2022-05-27

Applicant: Elite Material Co., Ltd.

Inventor： Tse-Hung Liu ,  Chia-Hung Wu

IPC: C08L71/12 ,  C08G73/10 ,  C08J5/24 ,  H05K3/38

Abstract: A resin composition includes 10 parts by weight of a first prepolymer and 5 parts by weight to 30 parts by weight of a vinyl group-containing polyphenylene ether resin, wherein the first prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, and the reaction mixture including a polyphenylmethane maleimide, a compound of Formula (1) and a compound of Formula (2) at a weight ratio of 100:10-30:15-45, and the resin composition is absent of a second prepolymer which is prepared by subjecting a maleimide and bis(trifluoromethyl)benzidine to a prepolymerization reaction. An article made from the resin composition may achieve improvement in at least one of the properties including ratio of electroless copper plating, storage modulus and copper foil peeling strength.