公开(公告)号：US11572469B2

公开(公告)日：2023-02-07

申请号：US17339566

申请日：2021-06-04

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien Hsu ,  Tse-Hung Liu ,  Tsan-Hung Tsai

IPC: C08K5/3492 ,  C08L71/12

Abstract: A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US10774210B2

公开(公告)日：2020-09-15

申请号：US16359060

申请日：2019-03-20

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien Hsu

IPC: C08L33/10 ,  C08L33/08 ,  C08L79/08 ,  C08K5/00 ,  C08K3/013

Abstract: Provided is a resin composition, which comprises 1 to 10 parts by weight of a bifunctional aliphatic long-chain acrylate and 30 to 50 parts by weight of a thermosetting resin. Moreover, an article is also provided, which is made from the resin composition described above. The article may comprise a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US11618820B2

公开(公告)日：2023-04-04

申请号：US17071322

申请日：2020-10-15

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien Hsu

IPC: C08L71/12 ,  C08L79/08

Abstract: A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US11407895B2

公开(公告)日：2022-08-09

申请号：US16923315

申请日：2020-07-08

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien Hsu

IPC: B32B27/26 ,  B32B27/28 ,  B32B27/38 ,  C08G59/24 ,  C08G59/50 ,  C08L79/08 ,  C08L63/00 ,  C08J5/24

Abstract: A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US11198788B2

公开(公告)日：2021-12-14

申请号：US16224105

申请日：2018-12-18

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Yi-Fei Yu ,  Ching-Hsien Hsu

IPC: C08L79/04 ,  C08L33/08 ,  C08L67/00 ,  C08L63/00 ,  C08L33/14 ,  C08J5/24 ,  C08J5/18 ,  C08G73/06

Abstract: A resin composition and an article made from the resin composition are provided. The resin composition comprises: 30 parts by weight of thermosetting resin; 50 to 125 parts by weight of maleimide resin; and 5 to 35 parts by weight of monofunctional long-chain alkyl acrylate monomer. The resin composition is capable of achieving a proper viscosity and a good filling property whiling maintaining a high glass transition temperature.

公开(公告)号：US10604651B1

公开(公告)日：2020-03-31

申请号：US16206511

申请日：2018-11-30

Applicant: Elite Material Co., Ltd.

Inventor： Ching-Hsien Hsu ,  Kok-Sheng Tan

IPC: C08L71/12 ,  H05K1/03 ,  C08G65/48 ,  C08K3/013 ,  C08K5/00 ,  H01B3/42

Abstract: A resin composition and an article made from the resin composition are disclosed. The resin composition comprises: a first vinyl-containing polyphenylene oxide resin, a prepolymer thereof or both; and a second vinyl-containing polyphenylene oxide resin or a prepolymer thereof; wherein the first vinyl-containing polyphenylene oxide resin has a number average molecular weight of between 500 and 1500, and the second vinyl-containing polyphenylene oxide resin has a number average molecular weight of between 1600 and 3500.