公开(公告)号：US20200083594A1

公开(公告)日：2020-03-12

申请号：US16609520

申请日：2017-05-23

申请人： Esa MÄÄTTÄ ,  HUAWEI TECHNOLOGIES CO., LTD.

发明人： Esa MAATTA ,  Jouni PENNANEN ,  Ilkka NIEMELA ,  Ilkka SAARINEN ,  Ismo MANELIUS ,  David POWNEY ,  Guoping LUO ,  Jari LAMMINPARRAS ,  Mikko KYLKILAHTI ,  Kyosti KATAJA

IPC分类号： H01Q1/24 ,  H01Q1/38 ,  H01Q21/00

摘要： An antenna assembly including a support and at least one conductive layer on the support having an antenna radiator patterned therein. The antenna assembly further includes a first conductive pad on the support, and the first conductive pad is electrically coupled to the antenna radiator. Additionally, the antenna assembly includes a radio frequency (RF) transmission line structure attached to the support, and the RF transmission line structure includes a signal line for transmitting an RF signal to or from the antenna radiator, the signal line being capacitively coupled to the first conductive pad.

公开(公告)号：US20210136192A1

公开(公告)日：2021-05-06

申请号：US16970208

申请日：2018-02-14

申请人： Huawei Technologies Co., Ltd.

发明人： Hongxue ZHANG ,  Jue LI ,  Guoping LUO

IPC分类号： H04M1/18 ,  H05K5/00 ,  H04M1/02 ,  G06F1/18

摘要： A housing structure for an electronic device comprises a support frame, supporting a front, a rear, and a side panel elements of the housing structure such that they are less sensitive to damages.