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公开(公告)号：US20210136192A1
公开(公告)日：2021-05-06
申请号：US16970208
申请日：2018-02-14
Applicant: Huawei Technologies Co., Ltd.
Inventor： Hongxue ZHANG , Jue LI , Guoping LUO
Abstract: A housing structure for an electronic device comprises a support frame, supporting a front, a rear, and a side panel elements of the housing structure such that they are less sensitive to damages.
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