公开(公告)号：US20210184142A1

公开(公告)日：2021-06-17

申请号：US17186275

申请日：2021-02-26

Applicant: FUJIFILM CORPORATION

Inventor： Eijiro IWASE ,  Koji TONOHARA ,  Hiroki SUGIURA

IPC: H01L51/05 ,  H01L51/00

Abstract: Provided are an organic thin film transistor that has high bendability and can suppress a decrease in carrier mobility caused by a pinhole of an insulating film or leveling properties and a method of manufacturing the organic thin film transistor. The organic thin film transistor includes: a gate electrode; an insulating film that is formed to cover the gate electrode; an organic semiconductor layer that is formed on the insulating film, and a source electrode and a drain electrode that are formed on the organic semiconductor layer, in which the insulating film includes an inorganic film consisting of SiNH.

公开(公告)号：US20220173371A1

公开(公告)日：2022-06-02

申请号：US17671624

申请日：2022-02-15

Applicant: FUJIFILM CORPORATION

Inventor： Akihito FUKUNAGA ,  Eijiro IWASE ,  Koji TONOHARA

IPC: H01M4/04 ,  H01M4/139

Abstract: The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of supplying the electrode material onto the support; and a step of pressurizing the electrode material on the support by sandwiching the support and the electrode material between a first roll that is brought into contact with the electrode material and a second roll that is brought into contact with the support, in which a temperature T1 of the first roll and a temperature T2 of the second roll satisfy a relationship T1>T2.

公开(公告)号：US20220131128A1

公开(公告)日：2022-04-28

申请号：US17647601

申请日：2022-01-11

Applicant: FUJIFILM CORPORATION

Inventor： Akihito FUKUNAGA ,  Eijiro IWASE ,  Koji TONOHARA ,  Yasuhiro SEKIZAWA

IPC: H01M4/04

Abstract: The present disclosure provides a method of manufacturing a formed body for an electrode including: a step of preparing an electrode material containing an electrode active material; a step of forming at least two projecting portions containing the electrode material and placed side by side on a support in a width direction of the support by supplying the electrode material onto the support; and a step of leveling the projecting portions on the support.

公开(公告)号：US20220158161A1

公开(公告)日：2022-05-19

申请号：US17591611

申请日：2022-02-03

Applicant: FUJIFILM CORPORATION

Inventor： Eijiro IWASE ,  Akihito FUKUNAGA ,  Koji TONOHARA ,  Takehiko NAKAYAMA ,  Yasuhiro SEKIZAWA

IPC: H01M4/04

Abstract: A method of manufacturing a formed body for an electrode includes a first step of dropping an electrode material containing an electrode active material into a gap between a pair of transport belts and introducing the electrode material between transport surfaces of the pair of transport belts; a second step of belt-transporting and pressurizing the introduced electrode material with the pair of transport belts; and a third step of transferring the electrode material after the belt transporting and the pressurization, on a deposition belt, in which a transport direction in a transport, passage through which the electrode material is transported, of the deposition belt intersects a transport direction in a transport passage, through which the electrode material is transported, of the pair of transport belts.

公开(公告)号：US20220123280A1

公开(公告)日：2022-04-21

申请号：US17563093

申请日：2021-12-28

Applicant: FUJIFILM CORPORATION

Inventor： Akihito FUKUNAGA ,  Eijiro IWASE ,  Koji TONOHARA

IPC: H01M4/1391 ,  H01M10/0585 ,  H01M10/0525

Abstract: A method of manufacturing a formed body for an electrode including: a step of jetting an electrode material containing an electrode active material from an outlet toward a surface FA of a first support while relatively moving the outlet jetting the electrode material and the first support in a plane direction of the first support, in which in the step, a contact member having a contact surface FB that is brought into contact with the electrode material is used, and in a case where a wall friction angle between the contact surface FB of the contact member and the electrode material is denoted by θ1, and a wall friction angle between the surface FA of the first support and the electrode material is denoted by θ2, a relationship (1) 1°≤θ1

公开(公告)号：US20220123275A1

公开(公告)日：2022-04-21

申请号：US17563092

申请日：2021-12-28

Applicant: FUJIFILM CORPORATION

Inventor： Eijiro IWASE ,  Akihito FUKUNAGA ,  Takehiko NAKAYAMA ,  Koji TONOHARA

IPC: H01M4/04 ,  H01M10/0525

Abstract: A method of manufacturing a formed body for an electrode includes: preparing an electrode material; placing a shape retaining member having an rectangular tubular shape with one opening portion L thereof facing down, and supplying the electrode material into the shape retaining member from the other opening portion M thereof, and discharging the electrode material onto a support from the opening portion L while relatively moving the opening portion L and the support, to form a film, a bulk density D1 of the electrode material in the first step and a bulk density D2 of the electrode material at the opening portion L satisfying a relationship of D2/D1=1.1 to 30, and a width T1 of the opening portion L in a short side direction and a distance T2 between the end portion X of the opening portion L and the support satisfying a relationship of width T1>distance T2.

公开(公告)号：US20220077447A1

公开(公告)日：2022-03-10

申请号：US17525976

申请日：2021-11-15

Applicant: FUJIFILM CORPORATION

Inventor： Eijiro IWASE ,  Akihito FUKUNAGA ,  Koji TONOHARA

IPC: H01M4/04

Abstract: The present disclosure provides a method of manufacturing a formed body for an electrode comprising in order: a step of preparing an electrode material containing an electrode active material; a step of supplying the electrode material to a forming mold which has a frame-shaped side wall portion defining a space portion accommodating the electrode material and has a first support placed on a bottom surface of the forming mold; a step of forming the electrode material along an internal shape of the forming mold; and a step of taking out the electrode material from the forming mold.

公开(公告)号：US20200009845A1

公开(公告)日：2020-01-09

申请号：US16577002

申请日：2019-09-20

Applicant: FUJIFILM Corporation

Inventor： Shotaro OGAWA ,  Kenji ICHIKAWA ,  Koji TONOHARA

IPC: B32B37/00 ,  H01L21/683 ,  H01L23/00 ,  B24B37/30

Abstract: A method for manufacturing a member to be treated includes: a first bonding step of bonding a member to be treated containing metal oxide and a first support to each other with a first adhesive layer; a first surface processing step of forming a first processed surface on the member to be treated; a first surface contact step of bringing a support having adhesiveness, an adsorption support which adsorbs the member to be treated, or a second adhesive layer, into contact with the first processed surface; a second bonding step of bonding the member to be treated and a second support with the second adhesive layer; and a second surface processing step of forming a second processed surface on a rear surface of the first processed surface of the member to be treated. In a case where the support having adhesiveness or the adsorption support and the first processed surface are in contact with each other, the support having adhesiveness or the adsorption support is removed in the first surface contact step. A first adhesive layer removing step of removing the first adhesive layer from the member to be treated is included between the first surface contact step and the second surface processing step.