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公开(公告)号:US20240287338A1
公开(公告)日:2024-08-29
申请号:US18659186
申请日:2024-05-09
Applicant: FUJIFILM Corporation
Inventor: Daigo MURAI
IPC: C09D11/38
CPC classification number: C09D11/38
Abstract: Provided are an ink jet ink including water and an organic solvent A having a surface tension of 20.0 mN/m to 29.0 mN/m, a Clog P value of 0.10 to 1.60, and a boiling point of 80° C. to 140° C., in which a content of the organic solvent A is in a range of 1% by mass to 20% by mass with respect to a total amount of the ink jet ink, and a dynamic surface tension of the ink jet ink at 10 ms is in a range of 28.0 mN/m to 38.0 mN/m, and an image recording method.
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公开(公告)号:US20220332921A1
公开(公告)日:2022-10-20
申请号:US17848893
申请日:2022-06-24
Applicant: FUJIFILM Corporation
Inventor: Aki NAKAMICHI , Takuya KITAMURA , Kengo SAITO , Daigo MURAI
IPC: C08K3/38 , C01B21/064
Abstract: The present invention provides boron nitride particles that can be used for preparation of a thermally conductive material having excellent thermally conductive properties and peel strength. In addition, the present invention provides a composition for forming a thermally conductive material, a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer, in relation to the boron nitride particles. In the boron nitride particles of the present invention, an atomic concentration ratio of oxygen atomic concentration to boron atomic concentration on a surface, detected by X-ray photoelectron spectroscopy, is 0.12 or greater, and a D value obtained by Equation (1) is 0.010 or less. D value=B(OH)3(002)/BN(002) Equation (1) B(OH)3(002): Peak strength derived from a (002) plane of boron hydroxide having a triclinic space group measured by X-ray diffraction BN(002): Peak strength derived from the (002) plane of boron nitride having a hexagonal space group measured by X-ray diffraction.
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公开(公告)号:US20250010649A1
公开(公告)日:2025-01-09
申请号:US18892646
申请日:2024-09-23
Applicant: FUJIFILM Corporation
Inventor: Yasuhito OSHIMA , Daigo MURAI
IPC: B41M7/00 , B41M5/00 , C09D11/037 , C09D11/101 , C09D11/322 , C09D11/38 , C09D11/54
Abstract: An ink jet recording method including, in the following order, a step of applying an ink containing a colorant and water onto an A surface which is one surface of a paper substrate by an ink jet recording system, a step of irradiating the A surface to which the ink has been applied with infrared rays having a maximal wavelength in a range of 800 nm to 3,000 nm, and a step of applying a post-treatment liquid containing water and a surfactant onto a B surface which is the other surface of the paper substrate, in which the paper substrate includes a pulp layer and a coating layer, the coating layer is disposed on an A surface side and a dry coating amount of the coating layer disposed on the A surface side is 15 g/m2 to 50 g/m2, and the coating layer is not disposed on a B surface side, or in a case where the coating layer is disposed on the B surface side, a dry coating amount of the coating layer disposed on the B surface side is 10 g/m2 or less.
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公开(公告)号:US20190010608A1
公开(公告)日:2019-01-10
申请号:US16131070
申请日:2018-09-14
Applicant: FUJIFILM Corporation
Inventor: Kohei HIGASHI , Takehiro KASAHARA , Daigo MURAI
Abstract: An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate. The method for producing an electroconductive laminate of the present invention includes: a step of forming a plated layer forming layer on a base material using a predetermined plated layer forming composition; a step of subjecting the plated layer forming layer to a patternwise exposure treatment and a development treatment to form a patterned plated layer containing a portion having a line width of less than 3 μm; a step of applying a plating catalyst or a precursor thereof to the patterned plated layer using an alkaline plating catalyst-applying liquid containing the plating catalyst or the precursor thereof; and a step of subjecting the patterned plated layer to which the plating catalyst or the precursor thereof has been applied to a plating treatment using a plating liquid containing aminocarboxylic acids to form a metal layer on the patterned plated layer.
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