公开(公告)号：US20230150057A1

公开(公告)日：2023-05-18

申请号：US18155838

申请日：2023-01-18

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Keigo MATSUNAGA ,  Taro MURAYAMA ,  Toshiaki SAKAI ,  Takashi KAYAHARA ,  Takashi SHIGEMATSU

IPC: B23K26/0622 ,  B23K26/38

CPC classification number: B23K26/0622 ,  B23K26/38 ,  B23K2101/34

Abstract: A laser cutting method for metal foil includes: cutting a processing target by laser by intermittently applying a pulse of laser beam to a surface of a metal foil serving as the processing target at a frequency of 1 [MHz] or less.