公开(公告)号：US20240326173A1

公开(公告)日：2024-10-03

申请号：US18579632

申请日：2022-07-15

Applicant: SAINT-GOBAIN GLASS FRANCE

Inventor： Cécile OZANAM ,  Florian BIGOURDAN

IPC: B23K26/402 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/53

CPC classification number: B23K26/402 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/53

Abstract: A method for separating a laminated glass panel including a film and at least two glass sheets, with the film being interposed between the two glass sheets, the method including weakening the mechanical properties of the panel using the energy of a laser beam along a predetermined separation line, by guiding the laser beam along the separation line, the separation line separating the panel into at least two pieces, wherein a laser device is used to provide the laser beam, the laser device providing a Bessel laser beam with a wavelength to which the glass sheets and the interlayer are transparent, wherein the length of the laser beam is at least equal to 80% of the thickness of the panel and the ratio of the scanning speed to the operating frequency is a value between two and seven times the diameter of the central lobe of the Bessel beam.

公开(公告)号：US20240308004A1

公开(公告)日：2024-09-19

申请号：US18661362

申请日：2024-05-10

Applicant: Taylor Made Golf Company, Inc.

Inventor： Mark Greaney ,  Stephen Kraus ,  Bryan Cheng ,  Kevin Cheng

IPC: B23K26/402 ,  A63B53/04 ,  B23K26/0622 ,  B23K103/18

CPC classification number: B23K26/402 ,  B23K26/0622 ,  A63B53/042 ,  A63B53/0466 ,  B23K2103/18

Abstract: A golf club head that includes a first part, a second part, and an adhesive between and bonding together a first-part bonding surface and a second-part ablated bonding surface. The second-part ablated bonding surface includes a second-part ablation pattern of peaks and valleys. The second-part ablation pattern of peaks and valleys includes first paths spaced apart relative to each other, and second paths spaced apart relative to each other and intersecting the first paths at spaced apart locations. Each one of the first paths and the second paths has a depth, relative to the peaks, that varies along its length. The depths of the first paths and the second paths are greater at the spaced apart locations where the first paths and the second paths intersect than where the first paths and the second paths do not intersect.

公开(公告)号：US12080996B2

公开(公告)日：2024-09-03

申请号：US17428712

申请日：2020-02-04

Applicant: SONY GROUP CORPORATION

Inventor： Go Hirano ,  Masanao Kamata

IPC: H01S5/183 ,  B23K26/06 ,  B23K26/0622 ,  G02B19/00 ,  G02F1/35 ,  H01L21/268 ,  H01S3/0941 ,  H01S3/1118 ,  H01S3/16 ,  H01S5/42

CPC classification number: H01S5/18305 ,  B23K26/0622 ,  B23K26/0661 ,  G02B19/0047 ,  G02F1/353 ,  H01L21/268 ,  H01S3/0941 ,  H01S3/1118 ,  H01S3/1618 ,  H01S3/1643 ,  H01S5/423

Abstract: To provide a laser processing machine, a processing method, and a laser light source that are capable of miniaturization. The laser processing machine includes a laser light source and an optical system. The laser light source includes a light emitting body including a substrate and a bottom emission type vertical-cavity surface-emitting laser element that is provided on one surface of the substrate and emits an excitation light beam from another surface side of the substrate, and a cavity that is disposed in contact with the light emitting body on the other surface side of the substrate and oscillates a pulsed laser beam by incidence of the excitation light beam. The optical system causes the pulsed laser beam to contract and applies the pulsed laser beam to a workpiece.

公开(公告)号：US20240278351A1

公开(公告)日：2024-08-22

申请号：US18571099

申请日：2021-07-01

Applicant: FANUC CORPORATION

Inventor： Jun YAGI

IPC: B23K26/0622 ,  B23K26/36

CPC classification number: B23K26/0622 ,  B23K26/36

Abstract: A numerical control device for controlling a laser machining device that machines a workpiece by means of a pulse laser emitted from a laser machining head while moving the laser machining head and the workpiece relative to each other, said numerical control device being provided with: a speed command generation unit for generating a speed command for controlling the speed of the relative movement on the basis of a machining program; a laser command generation unit for generating a laser output command value that includes at least the frequency and duty of the pulse laser, in accordance with the speed command; a change rate calculation unit for calculating a period command for the pulse laser on the basis of the frequency, and calculating a change rate of a changed period command changed by a limitation for the performance of the laser machining device; and a speed adjustment unit for using the change rate to adjust the speed command generated by the speed command generation unit.

公开(公告)号：US20240261903A1

公开(公告)日：2024-08-08

申请号：US18034079

申请日：2022-07-26

Applicant: JIANGSU UNIVERSITY

Inventor： Jinzhong LU ,  Weiwei DENG ,  Kaiyu LUO ,  Haifei LU

IPC: B23K26/356 ,  B23K26/00 ,  B23K26/0622 ,  C21D10/00

CPC classification number: B23K26/356 ,  B23K26/0006 ,  B23K26/0622 ,  C21D10/005

Abstract: A method of strengthening through real-time coupling of electrical pulses and laser shock waves is provided. The initial time and duration of the electrical pulses are controlled to be matched with the initial time and duration of the laser shock waves, so that the electrical pulses and the laser shock waves are coupled in real time for material strengthening, the plasticity and the strength of the material are greatly improved, and a large area of the workpiece is uniformly strengthened. By simultaneously introducing the electrical pulses into the pulse current-assisted LSP, a great strengthening effect is achieved through the combination of the electrical pulses and the pulse current-assisted LSP in a short time, thereby reducing the internal defects of the material to a certain extent and further increasing the fatigue life of the material.

公开(公告)号：US12057244B2

公开(公告)日：2024-08-06

申请号：US16929865

申请日：2020-07-15

Applicant: Heraeus Deutschland GmbH & Co. KG ,  Heraeus Medical Components LLC

Inventor： Jörg-Martin Gebert ,  Paul Schuster ,  Lisa Meyer

IPC: B05D3/06 ,  A61B5/00 ,  A61B5/1486 ,  B05D7/00 ,  B05D7/14 ,  B05D7/20 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/352 ,  B23K26/36 ,  H01B1/02 ,  H01B13/00 ,  H01B13/34 ,  B23K26/402 ,  B23K101/32 ,  B23K101/34

CPC classification number: H01B13/003 ,  A61B5/14865 ,  A61B5/686 ,  B05D3/065 ,  B05D7/14 ,  B05D7/20 ,  B05D7/54 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/355 ,  B23K26/36 ,  H01B1/02 ,  H01B13/348 ,  A61B2562/12 ,  A61B2562/125 ,  B23K26/402 ,  B23K2101/32 ,  B23K2101/34 ,  B05D2420/01 ,  B05D2503/00

Abstract: One aspect relates to a process for preparing a processed filament, including provision of a filament, including a segment. At least in the segment, the filament includes a core, including a first metal, a first layer which is superimposed on the core, and includes a polymer, and a second layer which is superimposed on the first layer, and includes a second metal. The segment of the filament is processed by interaction of the segment with at least one beam of electromagnetic radiation of a first kind. The electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm. Further, one aspect relates to a processed filament, obtainable by the process; a filament; an electrical device, including at least a part of the processed filament.

公开(公告)号：US12053838B2

公开(公告)日：2024-08-06

申请号：US18357186

申请日：2023-07-24

Applicant: TRUMPF Laser- und Systemtechnik GmbH

Inventor： Daniel Flamm ,  Michael Jenne ,  Henning Heiming

IPC: B23K26/067 ,  B23K26/0622 ,  B23K26/064

CPC classification number: B23K26/0673 ,  B23K26/0622 ,  B23K26/064

Abstract: An apparatus for laser machining a workpiece includes a beam shaping device for forming a focal zone from an input laser beam incident on the beam shaping device, and a telescope device for imaging the focal zone into a material of the workpiece. The beam shaping device is configured to impose a phase on a beam cross section of the input laser beam in such a way that the focal zone extends along a longitudinal centre axis which is curved at least in certain portions. The telescope device is assigned a beam splitting device for splitting an output laser beam output coupled from the beam shaping device into a plurality of polarized partial beams, each of which has one of at least two different polarization states. The focal zone has an asymmetrical cross section in a plane oriented perpendicular to the longitudinal centre axis.

公开(公告)号：US20240246172A1

公开(公告)日：2024-07-25

申请号：US18576704

申请日：2021-07-20

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Hiroshi Yamaoka ,  Satoki Nakada ,  Taketo Usami

IPC: B23K26/082 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/57

CPC classification number: B23K26/082 ,  B23K26/0622 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/57

Abstract: In the present invention, micro devices on a donor substrate are subjected to LIFT onto an opposed receptor substrate with high position accuracy by a scanning reduced projection optical system that forms an image of traverse multimode pulsed laser light with a minute area size onto the donor substrate through a lens array-type zoom homogenizer, an array mask 10, a scanning mirror 4, a photomask 6, and a telecentric projection lens 8. An implementation method thereof includes steps of inspection for acquiring position information, LIFT area division, irradiation position selection, transfer, and stage moving. This configuration can provide a scanning reduced projection optical system capable of scanning a minute irradiation area having a uniform and invariable energy distribution over a wide range with high accuracy and high speed while compensating for scanner accuracy deficiencies, without using expensive fθ lenses or telecentric reduced projection lenses with large apertures, as well as a LIFT apparatus for mounting or retransfer equipped with the scanning reduced projection optical system at low costs, and an implementation method thereof.

公开(公告)号：US20240238899A1

公开(公告)日：2024-07-18

申请号：US18288210

申请日：2022-04-26

Applicant: LIDROTEC GMBH

Inventor： Alexander Kanitz ,  Jan Stefan Hoppius ,  Jannis Köhler ,  Alexander Igelmann

IPC: B23K26/122 ,  B23K26/03 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/38

CPC classification number: B23K26/122 ,  B23K26/032 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/38

Abstract: A method for laser processing of workpieces in liquid, the method including the following steps:



providing a workpiece in a process chamber filled with a liquid;
focusing pulsed laser radiation on a surface of the workpiece using a focusing unit;
producing a relative movement between the focused laser radiation and the workpiece surface using a positioning unit;
detecting a gas bubble in a predefined detection region using a detection unit; and
conducting a first action to avoid or reduce interaction effects between the laser radiation and the detected gas bubble.

公开(公告)号：US20240183524A1

公开(公告)日：2024-06-06

申请号：US18551736

申请日：2022-03-23

Applicant: VALEO VISION

Inventor： Thibaut MENN ,  Laurent VIVET ,  Renan LEON ,  Jean-Francois BISSON ,  Baptiste DECROUY ,  Guillaume BONVALLAT

IPC: F21V29/76 ,  B23K26/0622 ,  B23K26/352 ,  F21S41/143 ,  F21S43/14 ,  F21S45/48 ,  F21Y115/10 ,  F28F13/18

CPC classification number: F21V29/767 ,  B23K26/0622 ,  B23K26/3584 ,  F21S45/48 ,  F28F13/185 ,  F21S41/143 ,  F21S43/14 ,  F21Y2115/10

Abstract: A heat sink for an electronic component and its manufacturing method by applying a nanopulsed laser. The heat sink includes a body provided with an outer layer, including a surface layer having a radiative exposed surface and a layer immediately underlying the surface layer. The underlying layer is made of a material based on a metal and the surface layer is made of an oxide of said material. The outer layer includes juxtaposed nodules. The heat sink originally combines a surface chemical state promoting heat emission and a structure geometrically promoting heat exchange, in order to synergistically improve its heat dissipation capability.