公开(公告)号：US20210178514A1

公开(公告)日：2021-06-17

申请号：US17183495

申请日：2021-02-24

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Tomomichi YASUOKA ,  Takashi KAYAHARA ,  Ryosuke NISHII ,  Koji KIRIKAE ,  Keigo MATSUNAGA ,  Takashi SHIGEMATSU

IPC: B23K26/067 ,  B23K26/06 ,  B23K26/21 ,  B23K26/32 ,  B23K26/08

Abstract: A welding method includes: emitting laser beam toward a workpiece including a metal to melt and weld a part of the workpiece, the part being where the laser beam has been emitted to. Further, the laser beam includes a main power region and at least one auxiliary power region, a power of the main power region is larger than a power of each of the at least one auxiliary power region, and a ratio between the power of the main power region and the total of powers of the at least one auxiliary power region is in a range of 144:1 to 1:9.

公开(公告)号：US20230001508A1

公开(公告)日：2023-01-05

申请号：US17932041

申请日：2022-09-14

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Keigo MATSUNAGA ,  Takashi KAYAHARA ,  Tomomichi YASUOKA ,  Kazuki TAKADA ,  Takashi SHIGEMATSU

IPC: B23K26/21 ,  B23K26/073 ,  B23K26/067

Abstract: A welding method includes: irradiating a surface of a workpiece with a laser light that moves relatively to the workpiece in a sweep direction; and performing welding by melting a part of the workpiece irradiated with the laser light. The laser light includes a plurality of beams, the plurality of beams include at least one main beam and at least one sub beam smaller in power than the main beam, a main power region including the at least one main beam and a sub power region including the at least one sub beam are formed on the surface, and a minimum distance between centers of adjacent ones of the plurality of beams on the surface is 75 μm or less.

公开(公告)号：US20250001526A1

公开(公告)日：2025-01-02

申请号：US18885803

申请日：2024-09-16

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Keigo MATSUNAGA ,  Yusuke NOGAMI ,  Takashi KAYAHARA

IPC: B23K26/38

Abstract: A laser cutting method includes: performing laser cutting on a metal foil by scanning, on a front surface of the metal foil with respect to the front surface, the front surface while irradiating the front surface with laser light. The laser light includes a plurality of beams, and the plurality of beams are arranged to form a spot group including a plurality of spots separated in a relative scanning direction on the front surface.

公开(公告)号：US20230219167A1

公开(公告)日：2023-07-13

申请号：US18185415

申请日：2023-03-17

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Atsushi OGINO ,  Ryosuke TAMURA ,  Kousuke KASHIWAGI ,  Masakazu YOSHIHARA ,  Keisuke TOMINAGA ,  Takashi KAYAHARA ,  Keigo MATSUNAGA

IPC: B23K26/0622 ,  B23K26/08

CPC classification number: B23K26/0622 ,  B23K26/0869 ,  B23K2101/18

Abstract: A laser processing method of laser processing a workpiece made of at least one sheet of metallic foil includes: generating laser light by supplying pulsed pumping energy to a laser medium, the laser light including an optical pulse component and a continuous light component that is continuous with the optical pulse component and temporally after the optical pulse component; irradiating a surface of the workpiece with the laser light; and limiting duration of the continuous light component such that a ratio of energy of the continuous light component to energy of the optical pulse component is equal to or less than a predetermined value.

公开(公告)号：US20230150057A1

公开(公告)日：2023-05-18

申请号：US18155838

申请日：2023-01-18

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Keigo MATSUNAGA ,  Taro MURAYAMA ,  Toshiaki SAKAI ,  Takashi KAYAHARA ,  Takashi SHIGEMATSU

IPC: B23K26/0622 ,  B23K26/38

CPC classification number: B23K26/0622 ,  B23K26/38 ,  B23K2101/34

Abstract: A laser cutting method for metal foil includes: cutting a processing target by laser by intermittently applying a pulse of laser beam to a surface of a metal foil serving as the processing target at a frequency of 1 [MHz] or less.