公开(公告)号：US20030057975A1

公开(公告)日：2003-03-27

申请号：US10202971

申请日：2002-07-25

Applicant: FormFactor, Inc.

Inventor： Mohammad Eslamy ,  David V. Pedersen ,  Harry D. Cobb

IPC: G01R031/02

CPC classification number: G01R31/2886 ,  G01R3/00 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49171 ,  Y10T29/49178 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211

Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

公开(公告)号：US20040058487A1

公开(公告)日：2004-03-25

申请号：US10667689

申请日：2003-09-22

Applicant: FormFactor, Inc.

Inventor： Mohammad Eslamy ,  David V. Pedersen ,  Harry D. Cobb

IPC: H01L021/8238

CPC classification number: G01R31/2886 ,  G01R3/00 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49171 ,  Y10T29/49178 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211

Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

Abstract translation: 一种制造大面积多元件接触器的方法。 提供分段接触器用于测试晶片上的半导体器件，其包括安装到衬底的多个接触器单元。 接触器单元被形成，测试和组装到背衬基板上。 接触器单元可以包括横向延伸的引线以连接到诸如老化板的外部仪器。 接触器单元包括诸如焊盘的导电区域，其被放置成与被测器件上的导电端子接触。