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公开(公告)号：US20240055393A1
公开(公告)日：2024-02-15
申请号：US18221171
申请日：2023-07-12
申请人： Invensas LLC
发明人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
IPC分类号： H01L23/00 , H01L23/31 , H01L23/498 , H01L21/56 , H01L25/10 , H01L25/00 , H01L23/495 , H01L21/48 , H01L23/367 , H01L23/433
CPC分类号： H01L24/85 , H01L23/3128 , H01L23/49811 , H01L21/56 , H01L24/78 , H01L25/105 , H01L25/50 , H01L23/49517 , H01L21/4853 , H01L23/3677 , H01L23/4334 , H01L23/49816 , H01L24/06 , H01L24/43 , Y10T29/49151 , Y10T29/49149 , H01L2224/45015 , H01L2924/181 , H01L2924/12042 , H01L2224/0401 , H01L24/45 , H01L2924/00011 , H01L21/565 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655
摘要： A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.
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公开(公告)号：US11735563B2
公开(公告)日：2023-08-22
申请号：US17512123
申请日：2021-10-27
申请人： Invensas LLC
发明人： Ellis Chau , Reynaldo Co , Roseann Alatorre , Philip Damberg , Wei-Shun Wang , Se Young Yang
IPC分类号： H01L23/00 , H01L23/31 , H01L23/498 , H01L21/56 , H01L25/10 , H01L25/00 , H01L23/495 , H01L21/48 , H01L23/367 , H01L23/433 , H01L25/065 , H05K3/34
CPC分类号： H01L24/85 , H01L21/4853 , H01L21/56 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/43 , H01L24/78 , H01L25/105 , H01L25/50 , H01L21/565 , H01L23/3114 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/4554 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4824 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/0651 , H01L2225/06506 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/1053 , H05K2201/10515 , Y10T29/49149 , Y10T29/49151 , H01L2224/45565 , H01L2224/45147 , H01L2224/45664 , H01L2224/45565 , H01L2224/45144 , H01L2224/45664 , H01L2924/19107 , H01L2224/45144 , H01L2224/45565 , H01L2224/45664 , H01L2924/19107 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/78301 , H01L2924/00014 , H01L2224/85986 , H01L2224/8518 , H01L2224/85951 , H01L2224/49171 , H01L2224/48227 , H01L2924/00 , H01L2224/49171 , H01L2224/48247 , H01L2924/00 , H01L2224/4824 , H01L2224/49171 , H01L2924/00 , H01L2224/73265 , H01L2224/32145 , H01L2224/48227 , H01L2924/00012 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00012 , H01L2224/73265 , H01L2224/32145 , H01L2224/48145 , H01L2924/00012 , H01L2224/73265 , H01L2224/32245 , H01L2224/48247 , H01L2924/00012 , H01L2224/45144 , H01L2924/00 , H01L2224/45124 , H01L2924/00 , H01L2224/45147 , H01L2924/00 , H01L2224/73265 , H01L2224/32145 , H01L2224/48247 , H01L2924/00 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00 , H01L2224/73265 , H01L2224/32245 , H01L2224/48227 , H01L2924/00 , H01L2224/73265 , H01L2224/32225 , H01L2224/48247 , H01L2924/00 , H01L2224/73204 , H01L2224/16145 , H01L2224/32145 , H01L2924/00 , H01L2224/131 , H01L2924/014 , H01L2924/15311 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00 , H01L2924/15311 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00 , H01L2924/01047 , H01L2924/00 , H01L2224/48091 , H01L2924/00014 , H01L2224/45015 , H01L2924/00 , H01L2224/45144 , H01L2924/00014 , H01L2224/45147 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2924/12042 , H01L2924/00 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/20751 , H01L2224/45015 , H01L2924/20752 , H01L2224/45015 , H01L2924/20753 , H01L2224/45015 , H01L2924/20754 , H01L2224/45015 , H01L2924/20755 , H01L2224/45015 , H01L2924/20756 , H01L2224/45015 , H01L2924/20757 , H01L2224/45015 , H01L2924/20758 , H01L2224/45015 , H01L2924/20759 , H01L2224/45015 , H01L2924/2076 , H01L2224/85399 , H01L2924/00014 , H01L2224/05599 , H01L2924/00014 , H01L2924/00011 , H01L2924/01049
摘要： A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.
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公开(公告)号：US09787039B2
公开(公告)日：2017-10-10
申请号：US15299215
申请日：2016-10-20
申请人： Hubbell Incorporated
发明人： Shadi Alex AbuGhazaleh , Joseph Edgar Dupuis , Christopher Wayne Gribble , Naved Shah Khan , Douglas Paul O'Connor
IPC分类号： H01R24/64 , H01R13/405 , H01R13/66 , H05K3/32 , H01R13/6466 , H01R24/62 , H01R43/20 , H01R13/24 , H01R107/00 , H05K1/18 , H05K3/40
CPC分类号： H01R24/64 , H01R13/24 , H01R13/2442 , H01R13/405 , H01R13/6466 , H01R13/6625 , H01R13/6658 , H01R24/62 , H01R43/20 , H01R43/205 , H01R2107/00 , H05K1/18 , H05K1/182 , H05K3/325 , H05K3/4015 , H05K2201/0133 , H05K2201/0311 , H05K2201/1031 , H05K2201/10424 , H05K2201/10446 , Y02P70/611 , Y10S439/941 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151
摘要： An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.
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公开(公告)号：US09741589B2
公开(公告)日：2017-08-22
申请号：US14796780
申请日：2015-07-10
IPC分类号： H01L21/48 , H01L23/538 , H01L23/13 , H05K1/11 , H05K1/02 , H01L23/00 , H01L23/498
CPC分类号： H01L21/4821 , H01L21/4825 , H01L21/4842 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L23/49894 , H01L23/5384 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13147 , H01L2224/13564 , H01L2224/13601 , H01L2224/13611 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/16225 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2924/0133 , H01L2924/014 , H01L2924/181 , H01L2924/351 , H05K1/0296 , H05K1/112 , Y10T29/49149 , H01L2924/01029 , H01L2924/0105 , H01L2924/01047 , H01L2924/00
摘要： A structure comprises a plurality of top pads protruding over a top surface of a package substrate, wherein a top pad comprises a first half-circle portion, a second half-circle portion and a first rectangular portion between the first half-circle portion and the second half-circle portion, a plurality of bottom pads embedded in the package substrate, wherein a bottom pad comprises a third half-circle portion, a fourth half-circle portion and a second rectangular portion between the third half-circle portion and the fourth half-circle portion and a plurality of vias coupled between the top pads and their respective bottom pads.
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公开(公告)号：US09680261B2
公开(公告)日：2017-06-13
申请号：US14301550
申请日：2014-06-11
CPC分类号： H01R13/6625 , H01Q1/002 , H01R24/48 , H01R43/005 , H04B5/0012 , Y10T29/49149
摘要： An intrinsic safe in-line adaptor with an integrated capacitive barrier for connecting a wireless module with an antenna. The in-line adaptor (e.g., N-type to N-type) can be designed to include an intrinsic safe circuit and the integrated capacitive barrier. The intrinsic safe circuit further includes a multi-layer PCB and the PCB can be potted and sealed with a mechanical metal casing. The intrinsic safe capacitive barrier can be integrated with a coaxial connector and mounted as part of a flameproof enclosure to meet an explosion safety standard and an intrinsic safety requirement. The mechanical metal casing can be isolated by the enclosure (e.g., rubber) to meet isolation requirements. The wireless module can be directly connected with the antenna utilizing the in-line adaptor via the coaxial connector and without any specific cable assembly.
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公开(公告)号：US09570872B2
公开(公告)日：2017-02-14
申请号：US14270289
申请日：2014-05-05
申请人： Jeffrey D. Carnevali
发明人： Jeffrey D. Carnevali
CPC分类号： H01R43/24 , B29C45/14065 , B29C45/14639 , B29C45/14655 , C08L23/16 , G06F1/1626 , G06F1/1632 , G06F1/1656 , G06F2200/1633 , H01R43/005 , H01R43/18 , H05K3/284 , H05K3/321 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171 , Y10T29/4922 , Y10T29/49222 , Y10T156/10
摘要： A method for mounting a rigid electrical connector, including selecting an electrical connector that is compatible with a predetermined portable electronic device; forming an aperture through an interface member, wherein the aperture is larger than the electrical connector; selecting an elastomeric potting material that is compatible with both the electrical connector and the interface member; locating the electrical connector in the aperture with a space between the electrical connector and the interface member; introducing the elastomeric potting material in an uncured state into the space between the electrical connector and the interface member; and while maintaining the space between the electrical connector and the interface member, curing the elastomeric potting material in the space therebetween.
摘要翻译： 一种用于安装刚性电连接器的方法，包括选择与预定便携式电子设备兼容的电连接器; 通过接口构件形成孔，其中所述孔大于所述电连接器; 选择与电连接器和接口构件兼容的弹性体灌封材料; 将电连接器定位在孔中，电连接器和接口构件之间具有空间; 将未固化状态的弹性体灌封材料引入到电连接器和接口构件之间的空间中; 并且在保持电连接器和接口部件之间的空间的同时，在其间的空间中固化弹性体灌封材料。
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7.发明申请公开(公告)号：US20170040760A1
公开(公告)日：2017-02-09
申请号：US15299215
申请日：2016-10-20
申请人： Hubbell Incorporated
发明人： Shadi Alex AbuGhazaleh , Joseph Edgar Dupuis , Christopher Wayne Gribble , Naved Shah Khan , Douglas Paul O'Connor
CPC分类号： H01R24/64 , H01R13/24 , H01R13/2442 , H01R13/405 , H01R13/6466 , H01R13/6625 , H01R13/6658 , H01R24/62 , H01R43/20 , H01R43/205 , H01R2107/00 , H05K1/18 , H05K1/182 , H05K3/325 , H05K3/4015 , H05K2201/0133 , H05K2201/0311 , H05K2201/1031 , H05K2201/10424 , H05K2201/10446 , Y02P70/611 , Y10S439/941 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151
摘要： An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.
摘要翻译： 适于接收配合插头的电连接器利用能够在其PCB固定的基座部分上弯曲的低轮廓的插座端子触头，其基本上平行于PCB。 每个末端接触件的远端连接部分或中间过渡部分中的任何弯曲是渐进的并且形成钝角，从而最小化应力集中。 触点优选地布置在两个相互面对的和交叉的四行触点中。 在一个实施例中，端子触头通过接触支架锚固到PCB，该接触支架将两个间隔开的锚固位置限制每个端子触头的基部，从而允许基部在其间弯曲。 在另一个实施例中，端子触点的基部嵌入至少一个弹性体构件中，该弹性构件安装到PCB上。
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公开(公告)号：US20160336159A1
公开(公告)日：2016-11-17
申请号：US15152290
申请日：2016-05-11
申请人： Owlstone Limited
发明人： Danielle Toutoungi , Matthew Hart , John Somerville , Jon Pearson , Max Allsworth , Richard Orrell , Antoni Negri , Jeremy Spinks , Martin Holden , Andrew H. Koehl , Alastair Taylor
CPC分类号： H01J49/061 , G01N27/624 , H01J49/0018 , H01J49/068 , Y10T29/49147 , Y10T29/49149
摘要： Ion filter for FAIMS fabricated using the LIGA technique. The ion filter is manufactured using a metal layer to form the ion channels and an insulating support layer to hold the structure rigidly together after separation of the metal layer into two electrodes.
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9.发明授权公开(公告)号：US09480170B2
公开(公告)日：2016-10-25
申请号：US13274897
申请日：2011-10-17
CPC分类号： H05K3/3457 , H01L21/4853 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/81192 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H05K3/3436 , H05K3/3478 , H05K2201/094 , H05K2203/0278 , H05K2203/041 , H05K2203/043 , Y10T29/49121 , Y10T29/49142 , Y10T29/49144 , Y10T29/49149 , Y10T29/49167 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.
摘要翻译： 制造具有焊料凸块的印刷线路板的方法包括形成具有小的和大的孔的阻焊层，暴露印刷线路板的各自的导电焊盘，使用具有 与阻焊层的孔相对应的孔径区域，从小孔中的焊球形成具有第一高度的第一凸起，以及从大孔中的焊球形成具有第二高度的第二凸起， 第一高度大于第二高度，并且按压第一凸起的顶部，使得第一高度变得与第二高度基本相同。 多层印刷布线板包括具有不同尺寸的孔的阻焊层和具有基本相等体积但高度差不大于10μm的焊料凸块。
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公开(公告)号：US09419403B2
公开(公告)日：2016-08-16
申请号：US13950628
申请日：2013-07-25
申请人： Samtec, Inc.
发明人： Chadrick Paul Faith , Keith Richard Guetig , Dale Francis Schmelz , Randall Eugene Musser , John Allen Mongold
CPC分类号： H01R43/20 , G02B6/428 , G02B6/4284 , H01R12/598 , H01R12/62 , H01R12/70 , H01R12/716 , H01R13/6275 , H01R43/0256 , H01R43/26 , H04B10/40 , Y10T29/49149
摘要： A transceiver for a two-connector system includes a circuit board, at least one cable attached to the circuit board, and a housing arranged to contain the circuit board. The two-connector system includes a front connector and a back connector. When the transceiver is connected to the two-connector system, a front edge of the circuit board is arranged to engage with the front connector and an intermediate portion of the circuit board is arranged to engage with the back connector.
摘要翻译： 一种用于双连接器系统的收发器包括电路板，至少一根连接到电路板的电缆以及被布置成容纳电路板的壳体。 双连接器系统包括前连接器和后连接器。 当收发器连接到双连接器系统时，电路板的前边缘被布置成与前连接器接合，并且电路板的中间部分布置成与后连接器接合。
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