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    Segmented contactor
    2.
    发明申请
    Segmented contactor 失效
    分段接触器

    公开(公告)号：US20040058487A1

    公开(公告)日：2004-03-25

    申请号：US10667689

    申请日：2003-09-22

    Applicant: FormFactor, Inc.

    Inventor： Mohammad Eslamy ,  David V. Pedersen ,  Harry D. Cobb

    IPC: H01L021/8238

    CPC classification number: G01R31/2886 ,  G01R3/00 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49171 ,  Y10T29/49178 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211

    Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

    Abstract translation: 一种制造大面积多元件接触器的方法。 提供分段接触器用于测试晶片上的半导体器件，其包括安装到衬底的多个接触器单元。 接触器单元被形成，测试和组装到背衬基板上。 接触器单元可以包括横向延伸的引线以连接到诸如老化板的外部仪器。 接触器单元包括诸如焊盘的导电区域，其被放置成与被测器件上的导电端子接触。

    Electronic component overlapping dice of unsingulated semiconductor wafer
    4.
    发明申请
    Electronic component overlapping dice of unsingulated semiconductor wafer 失效
    电子元件重叠的半导体晶片的重叠芯片

    公开(公告)号：US20020074653A1

    公开(公告)日：2002-06-20

    申请号：US09971981

    申请日：2001-10-04

    Applicant: FormFactor, Inc.

    Inventor： Igor Y. Khandros ,  David V. Pedersen ,  Benjamin N. Eldridge ,  Richard S. Roy ,  Gaetan Mathieu

    IPC: H01L023/52

    CPC classification number: H01L24/06 ,  H01L23/50 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00

    Abstract: The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In a preferred embodiments a terminal is provided on the semiconductor device such that the capacitor can be electrically connected directly to the terminals, as by soldering or with conductive epoxy. Connecting the capacitor between terminals of a power loop provides superior noise and transient suppression. The very short path between the capacitor and the active circuit provides for extremely low inductance, allowing for the use of relatively small capacitors. The semiconductor device then is connected to an electronic device such as a PC board for further connection to other circuitry. One particularly preferred mode of connection is by incorporating resilient, free-standing contact structures on the same semiconductor device, with the structures standing farther away from the semiconductor and the capacitor. Other useful connectors include providing similar resilient, free-standing contact structures on the other device, then positioning the semiconductor over the resilient contacts and securing the two devices together. A socket with such resilient structures is particularly useful for this application. In an alternative preferred embodiment, the capacitor and resilient contacts all are incorporated in the second device, such as a socket. In one aspect of the invention, the ancillary electrical component may include a travel stop structure which defines a minimum separation between the semiconductor and a substrate such as a printed circuit board.

    Abstract translation: 本发明提供了非常接近半导体器件的辅助电气部件，优选地直接安装在半导体器件上。 在一个优选实施例中，辅助电气部件是电容器。 在优选实施例中，端子设置在半导体器件上，使得电容器可以通过焊接或与导电环氧树脂直接电连接到端子。 在电源回路端子之间连接电容器可提供卓越的噪声和瞬态抑制。 电容器和有源电路之间的非常短的路径提供极低的电感，允许使用相对较小的电容器。 然后，半导体器件连接到诸如PC板的电子设备，用于进一步连接到其它电路。 一个特别优选的连接方式是通过在相同的半导体器件上并入弹性，独立的接触结构，其结构远离半导体和电容器。 其他有用的连接器包括在另一装置上提供类似的弹性，独立的接触结构，然后将半导体定位在弹性触点上并将两个装置固定在一起。 具有这种弹性结构的插座对于该应用特别有用。 在替代的优选实施例中，电容器和弹性触点都被并入第二装置，例如插座。 在本发明的一个方面，辅助电气部件可以包括限定半导体和诸如印刷电路板的基板之间的最小间隔的行进止动结构。

    Special contact points for accessing internal circuitry of an integrated circuit
    6.
    发明申请
    Special contact points for accessing internal circuitry of an integrated circuit 失效
    用于访问集成电路内部电路的特殊接点

    公开(公告)号：US20010020747A1

    公开(公告)日：2001-09-13

    申请号：US09753309

    申请日：2000-12-29

    Applicant: FormFactor, Inc.

    Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  David V. Pedersen ,  Ralph G. Whitten

    IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

    CPC classification number: G01R1/07307 ,  G01R31/2884 ,  G01R31/31723 ,  H01L22/32 ,  H01L23/50 ,  H01L23/60 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2224/29099 ,  H01L2924/00

    Abstract: One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e.g., nonvolatile circuits) at the die or package level. The special contact points may also be used to select redundant circuits for faulty circuits.

    Abstract translation: 本发明的一个实施例涉及包括接合焊盘和特殊接触焊盘或点的集成电路。 接合焊盘用于将集成电路作为整体与外部电路接口，并且将被连接到封装或电路板。 接合焊盘以预定的对准方式设置在管芯上，例如外围，栅格或中心对准。 特殊接触焊盘用于向内部电路提供外部测试模式和/或外部监测测试内部电路的结果。 特别的接触垫可以有利地以高度的位置自由度位于集成电路上。 对于一个实施例，特殊接触焊盘可以在与焊盘不同于对准的位置处设置在管芯上。 特殊的接触焊盘可以小于接合焊盘，以便不会由于特殊的接触垫而增加管芯的尺寸。 特殊接触点也可以用于在芯片或封装级别外部编程内部电路（例如非易失性电路）。 特殊接触点也可用于选择故障电路的冗余电路。

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