公开(公告)号：US11626357B2

公开(公告)日：2023-04-11

申请号：US17333890

申请日：2021-05-28

Applicant: FormFactor, Inc.

Inventor： Roy J. Henson ,  Shawn O. Powell

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/13 ,  H01L23/538 ,  H05K1/18 ,  H01R12/52

Abstract: 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

公开(公告)号：US20230269118A1

公开(公告)日：2023-08-24

申请号：US18114087

申请日：2023-02-24

Applicant: FormFactor, Inc. ,  Cirel Systems Private Limited

Inventor： Roy J. Henson ,  Hackjin Kim ,  Leela Madhav Lakkimsetti

IPC: H04L25/49 ,  H04L7/027

CPC classification number: H04L25/4902 ,  H04L7/027

Abstract: Improved serial communication is provided in a system where each node regenerates data and transmits it to at least one other node in the system. Pulse width modulation (PWM) is used to encode the data. Preferably, all pulse shapes of the PWM start with a synchronization feature. It is also preferred that the regeneration delay in each node be less than the system clock period.

公开(公告)号：US20210375733A1

公开(公告)日：2021-12-02

申请号：US17333890

申请日：2021-05-28

Applicant: FormFactor, Inc.

Inventor： Roy J. Henson ,  Shawn O. Powell

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/13 ,  H01L23/538 ,  H01R12/52 ,  H05K1/18

Abstract: 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.