公开(公告)号：US11626357B2

公开(公告)日：2023-04-11

申请号：US17333890

申请日：2021-05-28

Applicant: FormFactor, Inc.

Inventor： Roy J. Henson ,  Shawn O. Powell

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/13 ,  H01L23/538 ,  H05K1/18 ,  H01R12/52

Abstract: 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

公开(公告)号：US20210375733A1

公开(公告)日：2021-12-02

申请号：US17333890

申请日：2021-05-28

Applicant: FormFactor, Inc.

Inventor： Roy J. Henson ,  Shawn O. Powell

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/13 ,  H01L23/538 ,  H01R12/52 ,  H05K1/18

Abstract: 3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.