APPARATUS, SYSTEMS AND METHODS FOR SCALABLE 3D WIRELESS CHARGING UTILIZING MULTIPLE COILS

    公开(公告)号:US20220247219A1

    公开(公告)日:2022-08-04

    申请号:US17579941

    申请日:2022-01-20

    Abstract: A wireless power transfer (WPT) system is provided to drive multiple resonator coils utilizing one power amplifier. The WPT system may include a power amplifier, a differential 1:N power divider, impedance inversion circuits and multiple resonator coils. The WPT system may further include auto-tuning circuits with sensors that facilitate the efficient driving of the multiple resonator coils. As well, there is provided various 3D shaped coil topologies that are comprised of two or more separate coils. The 3D coil topology designs each provide a particular 3D magnetic field for wireless charging.

    HIGH EFFICIENCY RESONATOR COILS FOR LARGE GAP WIRELESS POWER TRANSFER SYSTEMS

    公开(公告)号:US20240186831A1

    公开(公告)日:2024-06-06

    申请号:US18494505

    申请日:2023-10-25

    CPC classification number: H02J50/12 H01F38/14

    Abstract: High efficiency resonator coils for large gap resonant wireless power transfer (WPT), and a coil design methodology are disclosed. Resonator coils comprise a coil topology defined by coil parameters in which turn dimensions, such as trace widths and spacings of each turn, are configured to reduce or minimize a variance of the z component of magnetic field, over an area of a charging plane at a specified distance, or distance range, from the coil. A Tx resonator coil comprises a capacitor arrangement of tuning and network-matching capacitors for improved coil-to-coil efficiency and end-to-end WPT system performance, e.g. for applications such as through-wall WPT, in the range of tens of watts to at least hundreds of watts. Planar resonator coil topologies are compatible with fabrication using low cost PCB technology, e.g. with multi-layer metal, to reduce losses and improve thermal performance.

    APPARATUS, SYSTEMS AND METHODS FOR LOAD-ADAPTIVE 3D WIRELESS CHARGING

    公开(公告)号:US20230075393A1

    公开(公告)日:2023-03-09

    申请号:US17800316

    申请日:2021-02-05

    Abstract: Apparatus, systems and methods for load-adaptive 3D wireless charging are disclosed. In a 3D charging system of an example embodiment, features comprise a 3D coil design that provides magnetic field distribution coverage for a 3D charging space, e.g.
    hemi-spherical space/volume; a push-pull class EF2 PA with EMI filter and transmitter circuitry that provides constant current to the 3D coil, with current direction, phase and timing control capability to adapt to load conditions; reactance shift detection circuitry comprising a voltage sensor, current sensor and phase detector and hardware for fast, real-time, computation of reactance and comparison to upper and lower limits for load-adaptive reactance tuning and for auto-protection; and a switchable tuning capacitor network arrangement of shunt and series capacitors configured for auto-tuning of input impedance, e.g. in response to a X detection trigger signal, which enables both coarse-tuning and uniform fine-tuning steps over an extended reactance range.

    HIGH EFFICIENCY RESONATOR COILS FOR LARGE GAP WIRELESS POWER TRANSFER SYSTEMS

    公开(公告)号:US20210184500A1

    公开(公告)日:2021-06-17

    申请号:US17094061

    申请日:2020-11-10

    Abstract: High efficiency resonator coils for large gap resonant wireless power transfer (WPT), and a coil design methodology are disclosed. Resonator coils comprise a coil topology defined by coil parameters in which turn dimensions, such as trace widths and spacings of each turn, are configured to reduce or minimize a variance of the z component of magnetic field, over an area of a charging plane at a specified distance, or distance range, from the coil. A Tx resonator coil comprises a capacitor arrangement of tuning and network-matching capacitors for improved coil-to-coil efficiency and end-to-end WPT system performance, e.g. for applications such as through-wall WPT, in the range of tens of watts to at least hundreds of watts. Planar resonator coil topologies are compatible with fabrication using low cost PCB technology, e.g. with multi-layer metal, to reduce losses and improve thermal performance.

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