公开(公告)号：US20160239012A1

公开(公告)日：2016-08-18

申请号：US15015614

申请日：2016-02-04

Applicant: GLOBALFOUNDRIES, INC.

Inventor： Givantha Iddawela ,  Alok Vaid

IPC: G05B19/401

CPC classification number: G01N21/9501 ,  G05B19/41875 ,  G05B2219/32179 ,  G05B2219/32182 ,  G05B2219/32187 ,  G05B2219/45031 ,  H01L22/10 ,  Y02P90/22

Abstract: Systems and methods for controlling manufacturing processes for microelectronic components are provided. In an exemplary embodiment, a method includes determining a specification range for a desired parameter. The microelectronic component is processed in a manufacturing tool, and a trace data set is recorded during the processing. An estimated trace data parameter is determined with the trace data set, and a first measured value of the microelectronic component is measured in a measurement tool. An estimated desired parameter is determined using the first measured value and the estimated trace data parameter, and the manufacturing process is adjusted when the estimated desired parameter is outside of the specification range.

Abstract translation: 提供了用于控制微电子部件的制造工艺的系统和方法。 在示例性实施例中，一种方法包括确定期望参数的规格范围。 在制造工具中处理微电子部件，并且在处理期间记录跟踪数据集。 使用跟踪数据集来确定估计的跟踪数据参数，并且在测量工具中测量微电子部件的第一测量值。 使用第一测量值和估计的跟踪数据参数来确定估计的期望参数，并且当估计的期望参数在规定范围之外时调整制造过程。

公开(公告)号：US09995692B2

公开(公告)日：2018-06-12

申请号：US15015614

申请日：2016-02-04

Applicant: GLOBALFOUNDRIES, INC.

Inventor： Givantha Iddawela ,  Alok Vaid

IPC: G06F19/00 ,  G01N21/95 ,  G05B19/418 ,  H01L21/66

CPC classification number: G01N21/9501 ,  G05B19/41875 ,  G05B2219/32179 ,  G05B2219/32182 ,  G05B2219/32187 ,  G05B2219/45031 ,  H01L22/10 ,  Y02P90/22

Abstract: Systems and methods for controlling manufacturing processes for microelectronic components are provided. In an exemplary embodiment, a method includes determining a specification range for a desired parameter. The microelectronic component is processed in a manufacturing tool, and a trace data set is recorded during the processing. An estimated trace data parameter is determined with the trace data set, and a first measured value of the microelectronic component is measured in a measurement tool. An estimated desired parameter is determined using the first measured value and the estimated trace data parameter, and the manufacturing process is adjusted when the estimated desired parameter is outside of the specification range.