公开(公告)号：US09851398B2

公开(公告)日：2017-12-26

申请号：US14673185

申请日：2015-03-30

Applicant: GLOBALFOUNDRIES INC.

Inventor： Fen Chen ,  Roger A. Dufresne ,  Charles W. Griffin ,  Kevin W. Kolvenbach

IPC: G01R31/28 ,  H01L23/522

CPC classification number: G01R31/2884 ,  G01R31/2831 ,  G01R31/2886 ,  H01L23/5226

Abstract: Various particular embodiments include a via testing structure, including: a first terminal coupled to a first set of sensing lines in a top level of the structure; a second terminal coupled to a second set of sensing lines in the top level of the structure, wherein first set of sensing lines and the second set of sensing lines are disposed in a comb arrangement; a third terminal coupled to a third set of sensing lines in a bottom level of the structure; and a plurality of vias electrically coupling the second set of sensing lines in the top level of the structure to the third set of sensing lines in the bottom level of the structure, each via having a via top and a via bottom.

公开(公告)号：US20160291084A1

公开(公告)日：2016-10-06

申请号：US14673185

申请日：2015-03-30

Applicant: GLOBALFOUNDRIES INC.

Inventor： Fen Chen ,  Roger A. Dufresne ,  Charles W. Griffin ,  Kevin W. Kolvenbach

IPC: G01R31/28 ,  H01L23/522

CPC classification number: G01R31/2884 ,  G01R31/2831 ,  G01R31/2886 ,  H01L23/5226

Abstract: Various particular embodiments include a via testing structure, including: a first terminal coupled to a first set of sensing lines in a top level of the structure; a second terminal coupled to a second set of sensing lines in the top level of the structure, wherein first set of sensing lines and the second set of sensing lines are disposed in a comb arrangement; a third terminal coupled to a third set of sensing lines in a bottom level of the structure; and a plurality of vias electrically coupling the second set of sensing lines in the top level of the structure to the third set of sensing lines in the bottom level of the structure, each via having a via top and a via bottom.

Abstract translation: 各种特定实施例包括通孔测试结构，包括：耦合到该结构顶层中的第一组感测线的第一端子; 第二终端，其耦合到所述结构的顶层中的第二组感测线，其中第一组感测线和所述第二组感测线设置在梳状布置中; 耦合到所述结构的底层中的第三组感测线的第三端子; 以及多个通孔将结构的顶层中的第二组感测线电耦合到结构的底部水平面中的第三组感测线，每个通孔具有通孔顶部和通孔底部。