公开(公告)号：US10372871B2

公开(公告)日：2019-08-06

申请号：US15662419

申请日：2017-07-28

Applicant: GLOBALFOUNDRIES INC.

Inventor： Lynn Tao-Ning Wang ,  Sriram Madhavan

IPC: G06F17/50

Abstract: An IC design layout is decomposed into multiple masks to produce an initial output. A post-decomposition optimization is performed. The post-decomposition optimization includes identifying hotspots in the multiple masks, clustering features that contribute to the hotspots into clusters, identifying ones of the clusters that can be relocated to a different mask to eliminate the hotspot, without violating design rules, as reversible clusters, ranking movement of the reversible clusters by comparing the reversible clusters, as potentially moved, to known manufacturability metrics, and moving the reversible clusters to different masks according to the priority established by the ranking, to produce a post-decomposition optimized tape-out. The IC devices are manufactured by applying the post-decomposition optimized tape-out to manufacturing equipment.

公开(公告)号：US20190034577A1

公开(公告)日：2019-01-31

申请号：US15662419

申请日：2017-07-28

Applicant: GLOBALFOUNDRIES INC.

Inventor： Lynn Tao-Ning Wang ,  Sriram Madhavan

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G03F1/36 ,  G03F7/00 ,  G06F2217/12

Abstract: An IC design layout is decomposed into multiple masks to produce an initial output. A post-decomposition optimization is performed. The post-decomposition optimization includes identifying hotspots in the multiple masks, clustering features that contribute to the hotspots into clusters, identifying ones of the clusters that can be relocated to a different mask to eliminate the hotspot, without violating design rules, as reversible clusters, ranking movement of the reversible clusters by comparing the reversible clusters, as potentially moved, to known manufacturability metrics, and moving the reversible clusters to different masks according to the priority established by the ranking, to produce a post-decomposition optimized tape-out. The IC devices are manufactured by applying the post-decomposition optimized tape-out to manufacturing equipment.