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公开(公告)号:US20190252200A1
公开(公告)日:2019-08-15
申请号:US16393339
申请日:2019-04-24
发明人: Ken-Hsien Hsieh , Wen-Li Cheng , Dong-Yo Jheng , Chih-Ming Lai , Ru-Gun Liu
IPC分类号: H01L21/308 , G06F17/50
CPC分类号: H01L21/3088 , G03F1/70 , G03F7/70425 , G06F17/5068 , G06F17/5081 , G06F2217/12
摘要: A method of fabricating an integrated circuit (IC) uses a first lithography technique having a first resolution and a second lithography technique having a second resolution lower than the first resolution. The method includes deriving a graph from an IC layout, the graph having vertices and edges that connect some of the vertices, the vertices representing IC patterns in the IC layout, the edges representing spacing between the IC patterns that are smaller than the second resolution. The method further includes classifying the edges into at least two types, a first type of edges representing spacing that is smaller than the first resolution, a second type of edges representing spacing that is equal to or greater than the first resolution but smaller than the second resolution.
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公开(公告)号:US20190242943A1
公开(公告)日:2019-08-08
申请号:US16389804
申请日:2019-04-19
发明人: WEI-PIN CHANGCHIEN , HONG-CHEN CHENG , PEI-YING LIN , HSIN-WU HSU
IPC分类号: G01R31/3177 , G06T7/00 , G01R31/308 , G06F17/50
CPC分类号: G01R31/3177 , G01R31/308 , G06F17/5081 , G06T7/001 , G06T2207/10061 , G06T2207/30148
摘要: A diagnostic system includes: a processor, arranged to extract a plurality of coordinates of a plurality of pins on an outer surface of a design layout according to a plurality of tagging texts labeling the plurality of pins respectively, and arranged to generate a design exchange format file according to the plurality of coordinates, wherein an order of the plurality of tagging texts are sorted by a predetermined scanning sequence; and a chip diagnostic tool, arranged to scan the plurality of scan components in a physical circuit on a testing platform through the plurality of pins on the outer surface of the physical circuit by following the predetermined scanning sequence to determine a defect component in the physical circuit according to the design exchange format file; wherein the physical circuit corresponds to the design layout.
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公开(公告)号:US20190236239A1
公开(公告)日:2019-08-01
申请号:US16257822
申请日:2019-01-25
发明人: YEN-HUNG LIN
IPC分类号: G06F17/50
CPC分类号: G06F17/5081 , G06F17/5077
摘要: A method for cell swapping is provided. A location for swapping a first cell is determined. One or more legal positions for cell placement are determined at the location. A plurality of cells is determined for of the plurality of legal positions. A second cell from the plurality of cells is determined based on timing information associated with each of the plurality. The first cell is swapped with the second cell.
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公开(公告)号:US20190213299A1
公开(公告)日:2019-07-11
申请号:US15864334
申请日:2018-01-08
CPC分类号: G06F17/5081 , G06F16/2455 , G06F17/5072
摘要: A universal circuit design environment that designs universal circuits that can be applied to a variety of applications is disclosed. The system cross-references attribute requirements of each contemplated application against components to select application set components that are used to populate the universal design circuit environment for use in a universal circuit design. The set components are capable of satisfying every resolvable attribute requirement of the variety of applications, and the universal circuit may be designed with specialized inputs to set some attributes of the universal circuit. Preferably, the footprint of each set component and universal circuit is preserved between versions to allow for optimized updating between component versions.
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公开(公告)号:US20190213292A1
公开(公告)日:2019-07-11
申请号:US16242405
申请日:2019-01-08
申请人: Atlazo, Inc.
发明人: Shahin Solki
IPC分类号: G06F17/50
CPC分类号: G06F17/5031 , G06F17/505 , G06F17/5081 , G06F2217/80 , G06F2217/84
摘要: Disclosed are techniques that can be used in a semiconductor chip to determine performance such as timing performance. Among other features, supply voltages and clock rates may be adjusted to accommodate the operating temperature and to compensate for the processing variations that occurred when that chip was produced, or may occur as the chip is used. The techniques include determining a series of variables that affect performance, determining the sensitivity of timing paths in the circuit to each variable, duplicating the most sensitive paths. A novel sensor circuit is produced that includes the sensitive paths, which can be used to determine when the chip is performing as required and when it is not, and adjusting one or more supply voltages and/or clock rates in a static or real time manner when the circuit is not performing as required.
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6.
公开(公告)号:US20190188356A1
公开(公告)日:2019-06-20
申请号:US15848736
申请日:2017-12-20
申请人: LIHONG ZHANG , XUAN DONG
发明人: LIHONG ZHANG , XUAN DONG
IPC分类号: G06F17/50
CPC分类号: G06F17/5081 , G06F17/5009 , G06F17/5036 , G06F17/5063
摘要: The present disclosure provides a method to maximize the overall chip yield. This method combines a PV-aware deterministic circuit sizing process with a hybrid OPC operation, and integrates them into an analog layout migration platform, which attempts to efficiently compose a layout by inheriting knowledge from a legacy layout and imposing new specifications, circuit sizing and constraints. The present method provides a sizing process, which explores robust circuit sizes under different PV conditions, especially considering mismatch effects on sensitive analog devices. The analog layout migration is conducted along the sizing flow for efficient layout synthesis with a unique benefit to better evaluation of the PV-related post-layout effects. After finishing the sizing process, a hybrid OPC operation, which adopts global rule-based OPC and local model-based OPC along with the PV-band shifting, is performed as a post-processing step. Thereafter, a target mask layout is created with fast processing time, high wafer image fidelity, low mask complexity, and robust circuit performance under PV conditions. This present method provides an efficient solution to layout synthesis with respect to analog ICs by combining the deterministic sizing process with fast analog layout migration and hybrid OPC operations.
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7.
公开(公告)号:US20190171789A1
公开(公告)日:2019-06-06
申请号:US16272391
申请日:2019-02-11
发明人: Chung-Yun CHENG , Chin-Chang HSU , Hsien-Hsin Sean LEE , Jian-Yi LI , Li-Sheng KE , Wen-Ju YANG
CPC分类号: G06F17/5081 , G03F1/70 , G06F17/5072 , G06F2217/12
摘要: A method of determining colorability of a layer of a semiconductor device includes iteratively decomposing a conflict graph to remove all nodes having fewer links than a threshold number of links. The method further includes determining whether the decomposed conflict graph is a simplified graph based on a comparison between the decomposed conflict graph and a stored conflict graph. The method further includes determining whether the decomposed conflict graph is colorable based on a number of masks used to pattern the layer of the semiconductor device. The method further includes flagging violations in response to a determination that the decomposed conflict graph is not colorable.
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公开(公告)号:US20190095573A1
公开(公告)日:2019-03-28
申请号:US15878009
申请日:2018-01-23
CPC分类号: G06F17/5081 , G03F1/36 , G06F17/5077 , G06F2217/06 , G06F2217/12 , H01L27/0207 , H01L27/11807 , H01L2027/11875
摘要: A method of generating a layout of an IC includes identifying a target pin in a first cell in an IC layout, the first cell being adjacent to a second cell and sharing a boundary with the second cell, and determining whether or not the target pin is capable of being extended into the second cell. Based on a determination that the target pin is capable of being extended into the second cell, the target pin is modified to include an extension into the second cell, the target pin thereby crossing the shared boundary. At least one of the identifying, determining, or modifying is executed by a processor of a computer.
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9.
公开(公告)号:US20190095551A1
公开(公告)日:2019-03-28
申请号:US15816210
申请日:2017-11-17
IPC分类号: G06F17/50
CPC分类号: G06F17/505 , G06F17/5022 , G06F17/5068 , G06F17/5081 , G06F2217/10 , G06F2217/12 , H01L27/0207
摘要: A technique for optimizing integrated circuit (IC) designs based on interaction between multiple integration design rules is provided. For a plurality of IC features, total risk values are determined based on multiple integration design rules. IC features are ordered based on the total risk values. IC features having the highest total risk values are selected based on a threshold count. An IC design is clipped around the high-risk IC features. An overall failure rate is simulated for the clipped area. If the overall failure rate exceeds a threshold, a predicted failure rate for each design rule that applies to IC features within the clipped area is calculated. A high-risk design rule is identified based on the predicted failure rates. The IC design is modified such that a difference between a design rule value of the high-risk design rule and a corresponding design value is reduced.
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10.
公开(公告)号:US20190072845A1
公开(公告)日:2019-03-07
申请号:US15696505
申请日:2017-09-06
发明人: CHIEH-YU LIN , DONGBING SHAO , KEHAN TIAN , ZHENG XU
CPC分类号: G03F1/36 , G03F1/38 , G03F1/70 , G06F17/5009 , G06F17/5081 , G06F2217/12
摘要: Technical solutions are described for fabricating a semiconductor wafer. An example method includes generating a process assumption band for an element of the wafer. The process assumption band depicts a shape of the element based on a set of process variations in a photolithographic process used for fabricating the wafer. The method also includes generating a process variation band for the element of the wafer based on optical process correction simulation of the photolithographic process using design rules associated with the wafer. The method also includes determining a deviation between the process assumption band and the process variation band, and recalculating one or more design rules from the design rules associated with the wafer based on the deviation. The method also includes updating the design of the wafer in response to the process variation band not being changeable to match the process assumption band, after recalculating the design rules.
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