公开(公告)号：US20130017679A1

公开(公告)日：2013-01-17

申请号：US13624235

申请日：2012-09-21

Applicant: GLOBALFOUNDRIES INC.

Inventor： Markus Lenski ,  Klaus Hempel ,  Vivien Schroeder ,  Robert Binder ,  Joachim Metzger

IPC: H01L21/28

CPC classification number: H01L21/823842 ,  H01L21/28088 ,  H01L21/82345 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/7833 ,  H01L29/7843

Abstract: Generally, the present disclosure is directed work function adjustment in high-k metal gate electrode structures. In one illustrative embodiment, a method is disclosed that includes removing a placeholder material of a first gate electrode structure and a second gate electrode structure, and forming a first work function adjusting material layer in the first and second gate electrode structures, wherein the first work function adjusting material layer includes a tantalum nitride layer. The method further includes removing a portion of the first work function adjusting material layer from the second gate electrode structure by using the tantalum nitride layer as an etch stop layer, removing the tantalum nitride layer by performing a wet chemical etch process, and forming a second work function adjusting material layer in the second gate electrode structure and above a non-removed portion of the first work function adjusting material layer in the first gate electrode structure.

Abstract translation: 通常，本公开涉及高k金属栅电极结构中的功函数调整。 在一个说明性实施例中，公开了一种方法，其包括移除第一栅极电极结构和第二栅电极结构的占位符材料，以及在第一和第二栅电极结构中形成第一功函数调节材料层，其中第一工件 功能调整材料层包括氮化钽层。 该方法还包括通过使用氮化钽层作为蚀刻停止层从第二栅极电极结构去除第一功函数调整材料层的一部分，通过执行湿化学蚀刻工艺去除氮化钽层，以及形成第二 第二栅电极结构中的功函数调整材料层，以及第一栅电极结构中的第一功函数调整材料层的未除去部分之上。

公开(公告)号：US08440559B2

公开(公告)日：2013-05-14

申请号：US13624235

申请日：2012-09-21

Applicant: Globalfoundries Inc.

Inventor： Markus Lenski ,  Klaus Hempel ,  Vivien Schroeder ,  Robert Binder ,  Joachim Metzger

IPC: H01L21/8234

CPC classification number: H01L21/823842 ,  H01L21/28088 ,  H01L21/82345 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/7833 ,  H01L29/7843

Abstract: Generally, the present disclosure is directed work function adjustment in high-k metal gate electrode structures. In one illustrative embodiment, a method is disclosed that includes removing a placeholder material of a first gate electrode structure and a second gate electrode structure, and forming a first work function adjusting material layer in the first and second gate electrode structures, wherein the first work function adjusting material layer includes a tantalum nitride layer. The method further includes removing a portion of the first work function adjusting material layer from the second gate electrode structure by using the tantalum nitride layer as an etch stop layer, removing the tantalum nitride layer by performing a wet chemical etch process, and forming a second work function adjusting material layer in the second gate electrode structure and above a non-removed portion of the first work function adjusting material layer in the first gate electrode structure.

Abstract translation: 通常，本公开涉及高k金属栅电极结构中的功函数调整。 在一个说明性实施例中，公开了一种方法，其包括移除第一栅极电极结构和第二栅电极结构的占位符材料，以及在第一和第二栅电极结构中形成第一功函数调节材料层，其中第一工件 功能调整材料层包括氮化钽层。 该方法还包括通过使用氮化钽层作为蚀刻停止层从第二栅极电极结构去除第一功函数调整材料层的一部分，通过执行湿化学蚀刻工艺去除氮化钽层，以及形成第二 第二栅电极结构中的功函数调整材料层，以及第一栅电极结构中的第一功函数调整材料层的未除去部分之上。