公开(公告)号：US11610839B2

公开(公告)日：2023-03-21

申请号：US16666808

申请日：2019-10-29

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Tung-Hsing Lee ,  Teng-Yin Lin ,  Frank W. Mont ,  Edward J. Gordon ,  Asmaa Elkadi ,  Alexander Martin ,  Won Suk Lee ,  Anvitha Shampur

IPC: H01L23/522 ,  H01L49/02 ,  H01F27/28 ,  H01F27/24 ,  H01F41/04

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.