Methods and systems for reinforced adhesive bonding using solder elements and flux

    公开(公告)号:US10160066B2

    公开(公告)日:2018-12-25

    申请号:US15340651

    申请日:2016-11-01

    Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.

    METHODS AND SYSTEMS FOR REINFORCED ADHESIVE BONDING USING SOLDER ELEMENTS AND FLUX

    公开(公告)号:US20180117716A1

    公开(公告)日:2018-05-03

    申请号:US15340651

    申请日:2016-11-01

    CPC classification number: B23K35/365 B23K1/203 B23K35/025

    Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.

    METHODS AND SYSTEMS FOR REINFORCED ADHESIVE BONDING USING SOLDER ELEMENTS AND FLUX

    公开(公告)号:US20180117694A1

    公开(公告)日:2018-05-03

    申请号:US15340608

    申请日:2016-11-01

    CPC classification number: B23K1/203 B23K3/0623

    Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The solder-adhesive mixture is heated to at least partially melt or at least partially vaporize the flux coating to promote a bonding condition between the solder-adhesive mixture and the first substrate. Finally, the second contact surface is then positioned adjacent the solder-adhesive mixture. The present technology additionally includes methods to produce a solder-reinforced adhesive bond joining a first substrate and a second substrate.

    FRICTION STIR BLIND RIVET JOINING SYSTEM AND METHOD

    公开(公告)号:US20190022737A1

    公开(公告)日:2019-01-24

    申请号:US15654295

    申请日:2017-07-19

    Abstract: Friction stir blind rivet systems and methods are provided for joining workpieces. A FSBR joining system includes a mandrel with a head forming a tip. A stem extends from the head and has a narrowed section forming a notch. A tail section of the mandrel is configured to break off at the notch forming a broken end. A shank also has a head and a body, with a through-hole defined through the shank. The shank head includes a shoulder forming a surface contacting one workpiece. The head has an outermost point opposite the surface. A range is defined between the outermost point of the head and the surface. A wall projects from another workpiece and is formed around the body. The wall has a size formed by the mandrel and that is controlled to enable the body to deform.

Patent Agency Ranking