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公开(公告)号：US10357941B2
公开(公告)日：2019-07-23
申请号：US15302852
申请日：2014-07-28
Applicant: GM Global Technology Operations LLC
Inventor： Yongqiang Li , Blair E. Carlson , Xin Yang , Jianfeng Wang
IPC: B23K31/02 , B32B7/12 , H05K3/36 , B32B27/08 , B32B27/32 , B32B27/36 , B32B3/26 , B32B37/06 , B32B37/12 , B23K1/00 , B23K1/20 , B23K35/02 , B32B5/02 , B32B15/08 , H05K3/32
Abstract: The present disclosure relates to a bonding system (100) comprising an adhesive (200), in contact with a first contact surface (115) and a second contact surface (125), and a solder mesh (310) positioned in the adhesive (200) in contact with the first contact surface (115). Also, the present disclosure relates to a bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and a second substrate (120), comprising applying, on a first contact surface (115) of the first substrate (110), an adhesive (200), positioning, at least partially into the adhesive (200), a solder mesh (310), such that the solder mesh (310) contacts the first contact surface (115), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), and applying heat to the first contact surface (115) such that at least one portion of the solder mesh (310) reaches a solder-bonding temperature.
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公开(公告)号：US09809093B2
公开(公告)日：2017-11-07
申请号：US15037624
申请日：2013-12-04
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Bin Hu , Jianfeng Wang , Xin Yang , Anil K. Sachdev
CPC classification number: B60J5/0455 , B22D17/00 , B22D17/005 , B22D17/22 , B22D17/24 , B22D19/02 , B22D21/007 , B22D25/02 , B60J5/0425 , B60J5/0426 , B60J5/045 , B60J5/0466 , B60J5/0483
Abstract: An inner door panel (30) for a vehicle side door that includes an integrated side impact beam (70) formed as part of the door in a die casting process. The inner door panel (30) includes an outer frame having a top rail (38), a bottom rail (40), an inner side rail (42) and an outer side rail (44) defining a central opening (34). The impact beam (70) includes a main beam portion (72), a first end support portion (74) and a second end support portion (78). The first end support portion is formed to the side rail (42) and the second end support portion (78) is formed to the outer side rail (44), where the main beam portion (72) extends across the opening (34).
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公开(公告)号：US20170028679A1
公开(公告)日：2017-02-02
申请号：US15302858
申请日：2014-07-28
Applicant: Xin YANG , GM Global Technology Operations LLC
Inventor： Yongqiang Li , Blair E. Carlson , Xin Yang , Jianfeng Wang
CPC classification number: B32B7/12 , B23K1/0008 , B23K1/20 , B23K35/0233 , B32B3/266 , B32B5/028 , B32B15/08 , B32B27/08 , B32B27/32 , B32B27/365 , B32B37/06 , B32B37/12 , B32B2255/06 , B32B2255/26 , B32B2262/103 , B32B2307/54 , B32B2307/542 , B32B2605/08 , H05K3/323 , H05K3/368 , H05K2203/041
Abstract: The present disclosure relates to a bonding system (100) comprising an adhesive (200), comprising thermoplastic material, in contact with a first contact surface (115) and a second contact surface (125), and a plurality of solder particles (300) positioned in the adhesive (200) in contact with the first contact surface (115). Also, the present disclosure relates to a bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and a second substrate (120), comprising applying, on a first contact surface (115) of the first substrate (110), an adhesive (200) comprising thermoplastic material, positioning, at least partially into the adhesive (200), each of a plurality of particles (300), such that each of the plurality of solder balls (300) contacts the first contact surface (115), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), and applying heat to the first contact surface (115) such that each of the plurality of solder particles (300) reaches a solder bonding temperature.
Abstract translation: 本公开涉及一种粘合系统（100），其包括与第一接触表面（115）和第二接触表面（125）接触的包含热塑性材料的粘合剂（200）和多个焊料颗粒（300） 定位在与第一接触表面（115）接触的粘合剂（200）中。 此外，本公开涉及一种用于生产连接第一基板（110）和第二基板（120）的焊料增强粘合剂粘结的接合方法，包括在第一基板（110）的第一接触表面（115） ），包括热塑性材料的粘合剂（200），至少部分地位于粘合剂（200）中，多个颗粒（300）中的每一个，使得多个焊球（300）中的每一个接触第一接触表面 （115）连接到与第一接触表面（115）相对的粘合剂（200）的一部分，第二基底（120）的第二接触表面（125），并向第一接触表面（115）施加热量， 使得多个焊料颗粒（300）中的每一个达到焊接接合温度。
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公开(公告)号：US10160066B2
公开(公告)日：2018-12-25
申请号：US15340651
申请日：2016-11-01
Applicant: GM Global Technology Operations LLC
Inventor： Xin Yang , Blair E. Carlson , Yongbing Li
IPC: B23K31/02 , B23K35/365 , B23K1/20 , B23K35/02
Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.
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公开(公告)号：US20150151359A1
公开(公告)日：2015-06-04
申请号：US14096527
申请日：2013-12-04
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Bin Hu , Jeff Wang , Xin Yang , Anil K. Sachdev
CPC classification number: B22D19/02 , B22C9/08 , B22D17/22 , B22D19/0081 , B22D21/007 , B22D25/02 , B60J5/045 , B60J5/0455 , B60J5/0458 , B60J5/0466 , B60J5/0483
Abstract: A method for manufacturing an inner door panel for a vehicle side door that employs a die casting process. The method includes providing a die cast mold having opposing mold halves that combine to define a die cavity configured to provide the inner door panel having an integrated impact beam. The mold cavity also includes channels that form a runner and gating system that causes the molten material to form an outer frame defining a central opening that allows the mold halves to be separated when the door panel has hardened within the mold.
Abstract translation: 一种用于制造车门侧门的内门板的方法，该车门侧门采用压铸工艺。 该方法包括提供具有相对的半模的压铸模具，其组合以限定被配置为提供具有集成冲击梁的内门板的模腔。 模具腔还包括形成流道和浇注系统的通道，其使得熔融材料形成限定中心开口的外框架，当门板在模具内硬化时允许半模分离。
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Patent Agency Ranking
公开(公告)号：US20180117716A1
公开(公告)日：2018-05-03
申请号：US15340651
申请日：2016-11-01
Applicant: GM Global Technology Operations LLC
Inventor： Xin Yang , Blair E. Carlson , Yongbing Li
IPC: B23K35/365 , B23K1/20 , B23K35/02
CPC classification number: B23K35/365 , B23K1/203 , B23K35/025
Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.
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公开(公告)号：US20180117694A1
公开(公告)日：2018-05-03
申请号：US15340608
申请日：2016-11-01
Applicant: GM Global Technology Operations LLC
Inventor： Xin Yang , Blair E. Carlson , Yongbing Li
CPC classification number: B23K1/203 , B23K3/0623
Abstract: The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The solder-adhesive mixture is heated to at least partially melt or at least partially vaporize the flux coating to promote a bonding condition between the solder-adhesive mixture and the first substrate. Finally, the second contact surface is then positioned adjacent the solder-adhesive mixture. The present technology additionally includes methods to produce a solder-reinforced adhesive bond joining a first substrate and a second substrate.
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公开(公告)号：US20170209948A1
公开(公告)日：2017-07-27
申请号：US15329191
申请日：2014-07-28
Applicant: GM Global Technology Operations LLC
Inventor： Xin Yang , Jianfeng Wang , Yongqiang Li , Blair E. Carlson
CPC classification number: B23K3/0638 , B23K3/0623 , B23K35/025 , H01R4/04 , H01R12/52 , H05K3/321 , H05K3/36 , H05K2203/0126 , H05K2203/1115 , H05K2203/163
Abstract: The present disclosure relates to a method, to distribute a solder-reinforced adhesive on a first substrate (110), comprising (i) positioning the first substrate (110) to receive an adhesive composite (250) including, an adhesive (200) and a plurality of solder balls (300) on a first contact surface (115) of the first substrate (110), (ii) applying, by a distribution nozzle (205), on the first contact surface (115), the adhesive composite (250), and (iii) distributing, by a conductive spreader (520), the adhesive composite (250). The present disclosure further relates to a method to determine electrical resistance of an solder-reinforced adhesive between a first substrate (110) and a second substrate (120), comprising (i) applying, by a distribution nozzle (205), on a first contact surface (115) of the first substrate (110), an adhesive composite (250) including, an adhesive (200) and a plurality of solder balls (300), (ii) positioning, to a portion of the adhesive composite (250) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), (iii) attaching, to the first substrate (110) and the second substrate (120), at least one electrical resistance detector (550), and (iv) applying, to the first substrate (110) and the second substrate (120), an electrical current.
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公开(公告)号：US09694420B2
公开(公告)日：2017-07-04
申请号：US15164504
申请日：2016-05-25
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Bin Hu , Jianfeng Wang , Xin Yang , Anil K. Sachdev
CPC classification number: B22D19/02 , B22C9/08 , B22D17/22 , B22D19/0081 , B22D21/007 , B22D25/02 , B60J5/045 , B60J5/0455 , B60J5/0458 , B60J5/0466 , B60J5/0483
Abstract: A method for manufacturing an inner door panel for a vehicle side door that employs a die casting process. The method includes providing a die cast mold having opposing mold halves that combine to define a die cavity configured to provide the inner door panel. An impact beam is positioned in the mold cavity prior to combining the first mold half and the second mold half, and a molten metal is provided to the mold cavity so that molten metal flows into all areas of the mold cavity and around the impact beam after the first mold half and the second mold half are combined. A solidified molded inner door panel is then removed from the die cast mold that includes an encapsulated impact beam.
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公开(公告)号：US20170114252A1
公开(公告)日：2017-04-27
申请号：US15302115
申请日：2014-04-09
Applicant: Xin YANG , GM Global Technology Operations LLC
Inventor： Xin Yang , Jing Zhang , Yongqiang Li , Jianfeng Wang , David Yang
CPC classification number: C09J11/04 , C08K3/08 , C08K7/18 , C09J5/00 , C09J5/06 , C09J2205/102 , C09J2400/163
Abstract: A bonding system comprising a first substrate, a first substrate (110) having a first contact surface (115) including a plurality of grooves (140), a second substrate (120) having a second contact surface (125), an adhesive (200) in contact with the first contact surface (115), and the second contact surface (125), and a plurality of solder balls (300) positioned at least partially in the adhesive (200) and in contact with the first contact surface (115). A bonding method comprising applying, on a first contact surface (115) including a plurality of grooves (140) an adhesive (200), positioning, at least partially in the adhesive (200), each of a plurality of solder balls (300), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125), and applying heat to the first contact surface (115) such that at least one of the plurality of solder balls (300) reaches a solder-ball bonding temperature whereat the solder ball bonds to the first contact surface (115).
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