公开(公告)号：US11581291B2

公开(公告)日：2023-02-14

申请号：US16643307

申请日：2017-07-24

Applicant: GOERTEK INC.

Inventor： Peixuan Chen ,  Quanbo Zou ,  Xiangxu Feng ,  Tao Gan ,  Xiaoyang Zhang

IPC: H01L25/075 ,  H01L33/00 ,  G09F9/33 ,  H01L21/683 ,  H01L21/78 ,  H01L33/48

Abstract: A micro-LED display device and a manufacturing method thereof are disclosed. The method comprises: forming micro-LEDs (202) on a carrier substrate (201), wherein the carrier substrate (201) is transparent for a laser which is used in laser lifting-off; filling trenches between the micro-LEDs (202) on the carrier substrate (201) with a holding material (209); performing a laser lifting-off on selected ones of the micro-LEDs (202) to lift off them from the carrier substrate (201), wherein the selected micro-LEDs (202) are held on the carrier substrate (201) through the holding material (209); bonding the selected micro-LEDs (202) onto a receiving substrate (207) of the micro-LED display device; separating the selected micro-LEDs (202) from the carrier substrate (201) to transfer them to the receiving substrate (207).

公开(公告)号：US11024611B1

公开(公告)日：2021-06-01

申请号：US16620224

申请日：2017-06-09

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Peixuan Chen ,  Xiangxu Feng ,  Tao Gan ,  Xiaoyang Zhang ,  Zhe Wang

IPC: H01L27/12 ,  H01L25/075 ,  H01L21/67 ,  H01L21/677 ,  H01L33/00 ,  H01L51/00 ,  H01L21/683 ,  H01L21/60

Abstract: A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.