PIC STRUCTURE WITH WIRE(S) BETWEEN Z-STOP SUPPORTS ON SIDE OF OPTICAL DEVICE ATTACH CAVITY

    公开(公告)号:US20240103237A1

    公开(公告)日:2024-03-28

    申请号:US17933199

    申请日:2022-09-19

    CPC classification number: G02B6/423 G02B6/4206 G02B6/424 G02B6/4274

    Abstract: A photonic integrated circuit (PIC) structure includes a substrate, and a cavity defined in the substrate, the cavity including a shoulder at a side of the cavity. A plurality of z-stop supports for an optical device are also included. Each z-stop support of the plurality of z-stop supports is on a support portion of the shoulder. A wire extends over the side of the cavity and between at least two z-stop supports of the plurality of z-stop supports. An optical device is positioned on the plurality of z-stop supports in the cavity and electrically coupled to the wire. Electrical connections between z-stop supports allows larger sized electrical connections to the optical device to mitigate electromigration issues, and increased options for electrical connections.

    PIC structure with wire(s) between z-stop supports on side of optical device attach cavity

    公开(公告)号:US12292603B2

    公开(公告)日:2025-05-06

    申请号:US17933199

    申请日:2022-09-19

    Abstract: A photonic integrated circuit (PIC) structure includes a substrate, and a cavity defined in the substrate, the cavity including a shoulder at a side of the cavity. A plurality of z-stop supports for an optical device are also included. Each z-stop support of the plurality of z-stop supports is on a support portion of the shoulder. A wire extends over the side of the cavity and between at least two z-stop supports of the plurality of z-stop supports. An optical device is positioned on the plurality of z-stop supports in the cavity and electrically coupled to the wire. Electrical connections between z-stop supports allows larger sized electrical connections to the optical device to mitigate electromigration issues, and increased options for electrical connections.

Patent Agency Ranking