公开(公告)号：US12272619B2

公开(公告)日：2025-04-08

申请号：US17971087

申请日：2022-10-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

公开(公告)号：US20250071952A1

公开(公告)日：2025-02-27

申请号：US18237126

申请日：2023-08-23

Applicant: Google LLC

Inventor： Feini Zhang ,  Arthur Joachim Korn ,  Joshua Michael Lehan

IPC: H05K7/20

Abstract: Generally disclosed herein is a mechanism to manage the thermal control of servers equipped in a data center based on the measurements of the power consumption of each server and each thermally critical component in the server system. A controller may monitor the power consumption of one or more components or one or more servers and trigger responsive cooling action by one or more cooling fans based on changes in the power consumption. In this regard, the cooling fans are proactively activated prior to temperatures reaching high levels, thereby efficiently maintaining safe operating temperatures in the data center for the computing devices and/or for occupational safety.

公开(公告)号：US20240040746A1

公开(公告)日：2024-02-01

申请号：US17878671

申请日：2022-08-01

Applicant: Google LLC

Inventor： Feini Zhang ,  Xu Zuo ,  Michael Chi Kin Lau ,  Madhusudan K. Iyengar

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20836 ,  H05K7/20772

Abstract: An adapter for coupling a liquid cooling loop subassembly of a computing system to a device rack manifold includes a main body, a first connector disposed on the main body, a second connector disposed on the main body, and a flow control device disposed between the first and second connectors. The first connector couples the adapter to a coupling of the liquid cooling loop subassembly. The second connector couples the adapter to the device rack manifold. The flow control device may be configured to regulate a flow rate of liquid coolant through the liquid cooling loop subassembly. The adapter may be further incorporated into a rack assembly or multi-rack assembly to achieve thermal management of multiple computing systems with cooling loop subassemblies.

公开(公告)号：US11488890B2

公开(公告)日：2022-11-01

申请号：US16880417

申请日：2020-05-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

公开(公告)号：US20220240421A1

公开(公告)日：2022-07-28

申请号：US17157373

申请日：2021-01-25

Applicant: Google LLC

Inventor： Feini Zhang ,  Madhusudan K. Iyengar ,  Reza H. Khiabani

IPC: H05K7/20

Abstract: A system includes a central supply line and a central return line connected to a fluid source of cooling liquid. A rack supply manifold is connected to the central supply line. A rack return manifold is connected to the central return line. A liquid cooling loop assembly may be coupled to at least one cooling device connected to a circuit board. Multiple inlet connectors may be connected to the rack supply manifold. Multiple outlet connectors may be connected to the rack return manifold. The multiple inlet connectors provide a passageway for the cooling liquid from the central supply line into the liquid cooling loop assembly for distribution to the at least one cooling device. The multiple outlet connectors provide a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device.

公开(公告)号：US20230037380A1

公开(公告)日：2023-02-09

申请号：US17971087

申请日：2022-10-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

公开(公告)号：US20210366806A1

公开(公告)日：2021-11-25

申请号：US16879101

申请日：2020-05-20

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Connor Burgess ,  Emad Samadiani ,  Padam Jain ,  Jorge Padilla ,  Feini Zhang ,  Yuan Li

IPC: H01L23/433 ,  F28F9/02 ,  H05K7/20

Abstract: Systems and methods for using spring force based compliance to minimize the bypass liquid flow gaps between the tops of chip microfins and bottom side of manifold ports are disclosed herein. A fluid delivery and exhaust manifold structure provides direct liquid cooling of a module. The manifold sits on top of a chip with flow channels. Inlet and outlet channels of the manifold in contact with flow channels of the chip creates an intricate crossflow path for the coolant resulting in improved heat transfer between the chip and the working fluid. The module is also designed with pressure reduction features using internal leakage flow openings to account for pressure differential between fluid entering and being expelled from the module.

公开(公告)号：US11683913B2

公开(公告)日：2023-06-20

申请号：US17157373

申请日：2021-01-25

Applicant: Google LLC

Inventor： Feini Zhang ,  Madhusudan K. Iyengar ,  Reza H. Khiabani

IPC: H05K7/20

CPC classification number: H05K7/20772

Abstract: A system includes a central supply line and a central return line connected to a fluid source of cooling liquid. A rack supply manifold is connected to the central supply line. A rack return manifold is connected to the central return line. A liquid cooling loop assembly may be coupled to at least one cooling device connected to a circuit board. Multiple inlet connectors may be connected to the rack supply manifold. Multiple outlet connectors may be connected to the rack return manifold. The multiple inlet connectors provide a passageway for the cooling liquid from the central supply line into the liquid cooling loop assembly for distribution to the at least one cooling device. The multiple outlet connectors provide a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device.

公开(公告)号：US20210366807A1

公开(公告)日：2021-11-25

申请号：US16880417

申请日：2020-05-21

Applicant: Google LLC

Inventor： Jorge Padilla ,  Madhusudan K. Iyengar ,  Connor Burgess ,  Padam Jain ,  Yuan Li ,  Feini Zhang

IPC: H01L23/433 ,  H01L25/065

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.