公开(公告)号：US20170295667A1

公开(公告)日：2017-10-12

申请号：US15511983

申请日：2014-09-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir CADER ,  John P FRANZ ,  David Allen MOORE ,  Douglas Kent GARDAY ,  Wade D Vinson

IPC: H05K7/20

CPC classification number: H05K7/20136 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20781 ,  H05K7/2079

Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.