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公开(公告)号：US20170318706A1
公开(公告)日：2017-11-02
申请号：US15522634
申请日：2014-10-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John P FRANZ , Tahir CADER
Abstract: Example implementations relate to a server device with a capacitive circuit. For example, a server device with a capacitive circuit can include a capacitive circuit located on a printed circuit assembly (PCA) of the server device and a baseboard management controller unit (BMC) to provide a communication interface between the capacitive circuit and a computing device. A voltage can be applied across the capacitive circuit and a signal can be sent from the capacitive circuit to the computing device using the BMC in response to a change in voltage.
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公开(公告)号：US20170303439A1
公开(公告)日：2017-10-19
申请号：US15512023
申请日：2014-09-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Tahir CADER , John P FRANZ , Wade D VINSON , Arlen L ROESNER , Kevin B LEIGH , Dave MAYER
CPC classification number: H05K7/20736 , H01R13/005 , H05K7/1487 , H05K7/1492 , H05K7/20781 , H05K7/20836
Abstract: A modular utility assembly is provided herein. The modular utility assembly includes a power module, a network module, and a cooling module. The power module includes a power connector to mate with and provide power to an electronic module. The network module includes a network connector to mate with and provide a network connection between the network module and the electronic module. The cooling module includes a cooling connector to mate with and connect to a cooling component on the electronic module.
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Patent Agency Ranking
公开(公告)号：US20170231118A1
公开(公告)日：2017-08-10
申请号：US15329246
申请日：2014-07-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Tahir CADER , Wade D VINSON , Douglas Kent GARDAY , John P FRANZ
IPC: H05K7/20
Abstract: An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.
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公开(公告)号：US20170196113A1
公开(公告)日：2017-07-06
申请号：US15315380
申请日：2014-07-08
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John NORTON , Melvin K BENEDICT , John P FRANZ
IPC: H05K7/14 , H01R12/73 , H01R13/629 , H05K7/20
CPC classification number: H05K7/1431 , H01R12/73 , H01R13/629 , H01R2201/06 , H05K7/20418
Abstract: A dual in-line memory module (DIMM) connector can include a double data rate fourth generation (DDR4) DIMM connector to connect to a DIMM via a lowest notch of the DIMM relative to an electronic component on which the DIMM is located.
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公开(公告)号：US20170359923A1
公开(公告)日：2017-12-14
申请号：US15523674
申请日：2014-10-31
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John P FRANZ , Tahir CADER
CPC classification number: H05K7/20781 , H05K7/04 , H05K7/1457 , H05K7/1488 , H05K7/20009 , H05K7/20254 , H05K7/20509 , H05K7/20736
Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.
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公开(公告)号：US20170295667A1
公开(公告)日：2017-10-12
申请号：US15511983
申请日：2014-09-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Tahir CADER , John P FRANZ , David Allen MOORE , Douglas Kent GARDAY , Wade D Vinson
IPC: H05K7/20
CPC classification number: H05K7/20136 , G06F1/20 , H05K7/20254 , H05K7/20736 , H05K7/20745 , H05K7/20781 , H05K7/2079
Abstract: A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.
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公开(公告)号：US20160356558A1
公开(公告)日：2016-12-08
申请号：US15120512
申请日：2014-05-15
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John P FRANZ , Tahir CADER , William K NORTON
CPC classification number: F28F9/0248 , F16L39/06 , F16L41/03 , F28D1/05325 , F28D2021/0028 , F28F9/0202 , F28F27/00 , F28F2230/00 , F28F2265/16 , H05K7/20272 , H05K7/20772
Abstract: An apparatus is provided herein. The apparatus includes a support member, a supply channel, a return channel, a supply port to provide a fluid to the supply channel, a return port to receive the fluid from the return channel, at least two port fittings, a first sleeve, and a second sleeve. The first sleeve is connectable to one of the at least two port fittings and forms a fluid tight seal between the first sleeve and the supply channel. The second sleeve is connectable to the other of the at least two port fittings and forms a fluid tight seal between the second sleeve and the return channel.
Abstract translation: 本文提供了一种装置。 该装置包括支撑构件，供应通道，返回通道，用于向供应通道提供流体的供应口，用于从返回通道接收流体的返回端口，至少两个端口配件，第一套管和 第二个袖子。 第一套筒可连接到至少两个端口配件中的一个，并在第一套筒和供应通道之间形成流体密封。 第二套筒可连接到至少两个端口配件中的另一个，并且在第二套筒和返回通道之间形成流体密封。
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