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公开(公告)号:US10768375B2
公开(公告)日:2020-09-08
申请号:US15749170
申请日:2015-07-31
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Kevin B. Leigh , George D. Megason
Abstract: An example electro-optical connector may comprise an optical ferrule to optically engage with a complementary optical ferrule on a complementary electro-optical connector, a first conductive guide post disposed adjacent to the optical ferrule to electrically engage with a first guide pocket of the complementary electro-optical connector, and a second conductive guide post disposed on an opposite side of the optical ferrule from the first conductive guide post and to electrically engage with a second guide pocket of the complementary electro-optical connector. The first and second conductive guide posts may align the optical ferrule for engagement with the complementary optical ferrule when the guide posts are engaged with the respective guide pockets, and the first and second conductive guide posts may conduct an electrical signal or electrical power from the electro-optical connector to the complementary electro-optical connector.
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公开(公告)号:US10707618B2
公开(公告)日:2020-07-07
申请号:US15560216
申请日:2015-04-03
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Kevin B. Leigh , George D. Megason
IPC: H01R13/631 , H01R13/516
Abstract: An example connector mount may comprise a bracket to receive a connector. The example connector mount may further comprise a first and second guide spring disposed on the bracket. Each of the first and second guide springs may be to engage with the connector and each provide resistance to movement of the connector in a horizontal, and a vertical direction.
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公开(公告)号:US09645337B2
公开(公告)日:2017-05-09
申请号:US14942415
申请日:2015-11-16
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Kevin B. Leigh , George D. Megason , David W. Sherrod , Christopher C. Wanner
CPC classification number: G02B6/4292 , G02B6/3897 , G02B6/43 , G02B6/4452 , H04B10/22 , H04B10/225 , H04B10/271 , H04B10/278 , Y10T29/49826
Abstract: A modular connector infrastructure includes device connector modules having optical connectors to optically connect to respective subsets of electronic devices in a system. The device connector modules are removably connected to the electronic devices.
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公开(公告)号:US20160223755A1
公开(公告)日:2016-08-04
申请号:US15021216
申请日:2013-10-02
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Kevin B. Leigh , George D. Megason , Chong Sin Tan
IPC: G02B6/38 , H01R13/629
CPC classification number: G02B6/3817 , G02B6/3885 , G02B6/3897 , H01R13/514 , H01R13/629
Abstract: A connector assembly includes a first connector that has an attachment feature. A second connector is removably attachable to the attachment feature of the first connector without establishing communication with the first connector. One of the first and second connectors is an optical connector, and another of the first and second connectors is an electrical connector.
Abstract translation: 连接器组件包括具有附接特征的第一连接器。 第二连接器可移除地附接到第一连接器的附接特征而不与第一连接器建立通信。 第一和第二连接器中的一个是光连接器,第一和第二连接器中的另一个是电连接器。
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公开(公告)号:US20200383207A1
公开(公告)日:2020-12-03
申请号:US16487249
申请日:2017-02-24
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Kevin Leigh , John Norton , George D. Megason
IPC: H05K1/14 , G06F1/18 , G06F1/3296 , G06F13/40 , H01L25/18 , H01L23/473 , H05K1/18 , H05K1/02
Abstract: Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.
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公开(公告)号:US10588234B2
公开(公告)日:2020-03-10
申请号:US16073008
申请日:2016-01-26
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Kevin B. Leigh , George D. Megason
Abstract: An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.
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公开(公告)号:US20190150319A1
公开(公告)日:2019-05-16
申请号:US16097517
申请日:2016-04-29
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: Kevin Leigh , John Norton , George D. Megason
IPC: H05K7/20 , H01L23/467 , H01L23/367 , G02B6/42
Abstract: An example device in accordance with an aspect of the present disclosure includes a first shield to provide thermal isolation between a first component and a heatsink of a second component, and to provide a cooling channel that is thermally isolated from the heatsink to receive an airflow for the first component. A second shield is to provide thermal isolation between the first shield and the heatsink, and to provide a thermal barrier region between the first shield and the second shield.
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公开(公告)号:US20180324971A1
公开(公告)日:2018-11-08
申请号:US15772292
申请日:2015-10-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: John R. Grady , George D. Megason , Joseph Allen
CPC classification number: H05K7/1489 , G06F1/181 , G06F1/183
Abstract: In one example, a shelf includes a shelf lock positioned within a spring retention pocket of the shelf. The shelf lock includes a main body that includes a spring retention slot to accommodate a spring and an opening to accommodate a pressure component. The shelf lock includes a retractable tab to be inserted into an enclosure to prevent movement of the shelf when mounted in the enclosure. The spring to exert an outward force to insert the retractable tab into the enclosure and the retractable tab to be retracted by an inward pressure.
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公开(公告)号:US09477050B2
公开(公告)日:2016-10-25
申请号:US14976180
申请日:2015-12-21
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor: George D. Megason , Kevin B. Leigh , David W. Sherrod
CPC classification number: G02B6/3897 , G02B6/3628 , G02B6/4261 , G02B6/4292 , G02B6/43 , G02B6/4452 , Y10T29/49826
Abstract: A plurality of connector modules are mounted to a support frame. The connector modules have respective optical connectors to optically connect with respective electronic devices, where the optical connectors are moveable between a retracted position and an extended position. The optical connector of a first of the connector modules is retractable and extendable independently of a second of the connector modules.
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公开(公告)号:US10534138B2
公开(公告)日:2020-01-14
申请号:US16068094
申请日:2015-12-22
Applicant: Hewlett Packard Enterprise Development LP
Inventor: Kevin B. Leigh , Sunil Ganta , John Norton , George D. Megason
Abstract: In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.
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