公开(公告)号：US10124579B2

公开(公告)日：2018-11-13

申请号：US15543420

申请日：2015-01-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Daryl E Anderson ,  George H Corrigan ,  Scott A Linn

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/175 ,  B41J2/145

Abstract: An inkjet printhead including a plurality of printhead dies, each printhead die including at least one crack sense resistor, at least one analog bus connected to each printhead die, and a controller separate from the plurality of printhead dies. The controller is configured to provide a known current to the at least one crack sense resistor of each printhead die in a selectable pattern via the at least one analog bus and to determine whether the printhead dies are cracked based on resulting voltages produced on the at least one analog bus.

公开(公告)号：US20180001618A1

公开(公告)日：2018-01-04

申请号：US15543420

申请日：2015-01-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Daryl E Anderson ,  George H Corrigan ,  Scott A Linn

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/145

CPC classification number: B41J2/0451 ,  B41J2/04501 ,  B41J2/0458 ,  B41J2/04581 ,  B41J2/04586 ,  B41J2/14153 ,  B41J2/145 ,  B41J2/175 ,  B41J2202/20 ,  B41J2202/21

Abstract: An inkjet printhead including a plurality of printhead dies, each printhead die including at least one crack sense resistor, at least one analog bus connected to each printhead die, and a controller separate from the plurality of printhead dies. The controller is configured to provide a known current to the at least one crack sense resistor of each printhead die in a selectable pattern via the at least one analog bus and to determine whether the printhead dies are cracked based on resulting voltages produced on the at least one analog bus.

公开(公告)号：US10040281B2

公开(公告)日：2018-08-07

申请号：US15519298

申请日：2014-10-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Daryl E Anderson ,  George H Corrigan ,  Scott A Linn

IPC: B41J2/045 ,  B41J2/155 ,  B41J2/14

Abstract: A wide array printhead module includes a plurality of printhead die. Each of the printhead die includes a number of sensors to measure properties of a number of elements associated with the printhead die. The wide array printhead module further includes an application specific integrated circuit (ASIC) to command and control each of the printhead die. The ASIC is located off any of the printhead die.

公开(公告)号：US20170232734A1

公开(公告)日：2017-08-17

申请号：US15519298

申请日：2014-10-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Daryl E Anderson ,  George H Corrigan ,  Scott A Linn

IPC: B41J2/045 ,  B41J2/14 ,  B41J2/155

CPC classification number: B41J2/04541 ,  B41J2/0458 ,  B41J2/14072 ,  B41J2/14112 ,  B41J2/14153 ,  B41J2/155 ,  B41J2/17546 ,  B41J2002/14491 ,  B41J2202/13 ,  B41J2202/19 ,  B41J2202/20

Abstract: A wide array printhead module includes a plurality of printhead die. Each of the printhead die includes a number of sensors to measure properties of a number of elements associated with the printhead die. The wide array printhead module further includes an application specific integrated circuit (ASIC) to command and control each of the printhead die. The ASIC is located off any of the printhead die.