公开(公告)号：US20190041901A1

公开(公告)日：2019-02-07

申请号：US16051032

申请日：2018-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： John William Pennington, JR. ,  Fu-Yi Chen ,  ShuChun Hsiao ,  Daniel Young Yoon ,  Insun Hong ,  Will Macia

IPC: G06F1/16

Abstract: A wearable computing device mount may include a harness wearable by a user; a plate attached to the harness, wherein a computing device is selectively mounted to the plate via mechanical fasteners, the plate including a plurality of stanchions to separate a back side of the plate from the harness; and a docking station, the docking station to communicatively couple to the computing device.

公开(公告)号：US20170023975A1

公开(公告)日：2017-01-26

申请号：US15302246

申请日：2014-04-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Saro Nalbandian ,  John William Pennington, JR.

IPC: G06F1/16 ,  H04R1/02

CPC classification number: G06F1/1632 ,  G06F1/1626 ,  G06F1/166 ,  H04R1/028 ,  H04R2205/021 ,  H04R2420/07 ,  H04R2499/15

Abstract: In one example in accordance with the present disclosure, an audio docking device is provided. The audio docking device includes a speaker to produce sound in response to an input, and further includes a docking slot to receive and hold a kickstand of an electronic display device within the docking slot and enable a housing of the electronic display device to rotate relative to the audio docking device.

Abstract translation: 在根据本公开的一个示例中，提供音频对接装置。 音频对接装置包括响应于输入产生声音的扬声器，并且还包括对接槽，用于在对接槽内接收和保持电子显示装置的支架，并使电子显示装置的外壳相对于 音频对接设备。

公开(公告)号：US20210373627A1

公开(公告)日：2021-12-02

申请号：US17059570

申请日：2018-12-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： John William Pennington, JR. ,  Rahul Shrikant Patil

IPC: G06F1/20 ,  H05K7/20

Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation