公开(公告)号：USD944244S1

公开(公告)日：2022-02-22

申请号：US29786386

申请日：2021-05-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Designer： Henry Ken Chu ,  Daniel Young Yoon ,  Siddhartha Bhat ,  Glenn A Wong ,  John William Pennington, Jr. ,  Rahul Shrikant Patil

公开(公告)号：USD893477S1

公开(公告)日：2020-08-18

申请号：US29688511

申请日：2019-04-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Designer： Siddhartha Bhat ,  Rahul Shrikant Patil ,  John William Pennington, Jr. ,  Glenn A. Wong

公开(公告)号：US11460899B2

公开(公告)日：2022-10-04

申请号：US17059570

申请日：2018-12-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： John William Pennington, Jr. ,  Rahul Shrikant Patil

IPC: G06F1/20 ,  H05K7/20

Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.

公开(公告)号：US20210373627A1

公开(公告)日：2021-12-02

申请号：US17059570

申请日：2018-12-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： John William Pennington, JR. ,  Rahul Shrikant Patil

IPC: G06F1/20 ,  H05K7/20

Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation

公开(公告)号：US12153480B2

公开(公告)日：2024-11-26

申请号：US17901147

申请日：2022-09-01

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： John William Pennington, Jr. ,  Rahul Shrikant Patil

IPC: G06F1/20 ,  H05K7/20

Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.

公开(公告)号：US20220413575A1

公开(公告)日：2022-12-29

申请号：US17901147

申请日：2022-09-01

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： John William Pennington, Jr. ,  Rahul Shrikant Patil

IPC: G06F1/20 ,  H05K7/20

Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.

公开(公告)号：USD944243S1

公开(公告)日：2022-02-22

申请号：US29722792

申请日：2020-01-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Designer： Henry Ken Chu ,  Daniel Young Yoon ,  Siddhartha Bhat ,  Glenn A Wong ,  John William Pennington, Jr. ,  Rahul Shrikant Patil