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    Electronic device
    5.
    外观设计
    Electronic device 有权

    公开(公告)号：USD1042470S1

    公开(公告)日：2024-09-17

    申请号：US29858218

    申请日：2022-10-28

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Designer： Glenn A. Wong ,  Kevin L. Massaro ,  David N. Skinner ,  John William Pennington, Jr. ,  Stacy L. Wolff ,  Siddhartha Bhat ,  Marcus Hoggarth

    Abstract: FIG. 1 is a perspective view of an electronic device in accordance with the new design;
    FIG. 2 is a front view of the electronic device of FIG. 1;
    FIG. 3 is a back view of the electronic device of FIG. 1;
    FIG. 4 is a left side view of the electronic device of FIG. 1;
    FIG. 5 is a right side view of the electronic device of FIG. 1;
    FIG. 6 is a top view of the electronic device of FIG. 1;
    FIG. 7 is a bottom view of the electronic device of FIG. 1; and,
    FIG. 8 is another front view of the electronic device of FIG. 1.
    The evenly-spaced broken lines in FIGS. 1-8 illustrate portions of the electronic device that form no part of the claimed design. The dash-dot-dash broken lines in FIGS. 1-5 and 8 illustrate the boundary of the claimed design which forms no part thereof.
    The stippled shading and line shading shown in FIGS. 1-6 and 8 represent a contrasting appearance.

    Computing devices with integrated and isolated liquid cooling
    6.
    发明授权
    Computing devices with integrated and isolated liquid cooling 有权

    公开(公告)号：US11460899B2

    公开(公告)日：2022-10-04

    申请号：US17059570

    申请日：2018-12-13

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： John William Pennington, Jr. ,  Rahul Shrikant Patil

    IPC: G06F1/20 ,  H05K7/20

    Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.

    Self-Deploying Stand Foot
    9.
    发明申请
    Self-Deploying Stand Foot 有权

    公开(公告)号：US20250109820A1

    公开(公告)日：2025-04-03

    申请号：US18528184

    申请日：2023-12-04

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Benjamin Carroll ,  John William Pennington, Jr. ,  Marcus Hoggarth ,  Stephen Philip de Saulles ,  Michael Brown

    IPC: F16M13/00

    Abstract: The present disclosure provides a portable electronic device including a frame body supporting electronic components and a stand mechanism. The stand mechanism includes a foot, and an activator. The foot includes a foot support and a foot shaft including a foot guide path. The activator includes an engaging element, and the engaging element is received by the foot guide path. A portion of the foot guide path extends at an angle relative to a longitudinal axis of the foot shaft. When the activator engages a surface, the engaging element of the activator moves along the portion of the foot guide path at the angle relative to the longitudinal axis of the foot shaft causing the foot support to rotate from a stored position to a deployed position.

    Computing devices with integrated and isolated liquid cooling
    10.
    发明授权
    Computing devices with integrated and isolated liquid cooling 有权

    公开(公告)号：US12153480B2

    公开(公告)日：2024-11-26

    申请号：US17901147

    申请日：2022-09-01

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： John William Pennington, Jr. ,  Rahul Shrikant Patil

    IPC: G06F1/20 ,  H05K7/20

    Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.

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