中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

11 records (took 0.013 seconds)

    HEAT TRANSFER METHODS, SYSTEMS AND COMPOSITIONS
    3.
    发明申请
    HEAT TRANSFER METHODS, SYSTEMS AND COMPOSITIONS 有权

    公开(公告)号：US20210355358A1

    公开(公告)日：2021-11-18

    申请号：US17322945

    申请日：2021-05-18

    Applicant: HONEYWELL INTERNATIONAL INC.

    Inventor： Ankit SETHI ,  Samuel F. Yana Motta ,  Elizabet del Carmen Vera Becerra ,  Yang Zou ,  Henna Tangri ,  Gregory L. Smith

    IPC: C09K5/04

    Abstract: Disclosed are methods for providing heating and/or cooling of the type comprising evaporating refrigerant liquid and condensing refrigerant vapor in a plurality of repeating cycles, where the method comprises (a) providing the refrigerant comprising at least about 5% by weight of a lower alkyl iodofluorocarbon; and (b) exposing at least a portion of said refrigerant in at least a portion of said plurality of said cycles to a sequestration material comprising: i) copper or a copper alloy; ii) a molecular sieve (preferably a zeolite), comprising copper, silver, lead or a combination thereof; iii) an anion exchange resin, and iv) a combination of two or more of these, wherein said exposing temperature is preferably above about 20 C.

    HEAT TRANSFER COMPOSITIONS, METHODS, AND SYSTEMS
    4.
    发明申请
    HEAT TRANSFER COMPOSITIONS, METHODS, AND SYSTEMS 有权

    公开(公告)号：US20230055718A1

    公开(公告)日：2023-02-23

    申请号：US17872434

    申请日：2022-07-25

    Applicant: HONEYWELL INTERNATIONAL INC.

    Inventor： Kaimi Gao ,  Henna Tangri ,  Ankit Sethi ,  Ryan Hulse

    IPC: C09K5/04 ,  F25B1/00

    Abstract: The present invention relates to a refrigerant composition comprising at least about 98.5% by weight of the following three compounds, with each compound being present in the following relative percentages: 33.0% to 45% by weight difluoromethane (HFC-32);
    48.5% to 67.0% by weight of 2,3,3,3-tetrafluoropropene (HFO-1234yf); and
    1.0% to 6.0% by weight fluoroethane (HFC-161), and to the use of the refrigerant in a heat exchange system, including air conditioning, refrigeration applications and heat pump applications and to the use of such compositions as a replacement of the refrigerant R-410A or R-32 or R-454B for heating and cooling applications.

    HEAT TRANSFER METHODS, SYSTEMS AND COMPOSITIONS
    5.
    发明申请
    HEAT TRANSFER METHODS, SYSTEMS AND COMPOSITIONS 审中-公开

    公开(公告)号：US20190085224A1

    公开(公告)日：2019-03-21

    申请号：US16135962

    申请日：2018-09-19

    Applicant: HONEYWELL INTERNATIONAL INC.

    Inventor： Ankit SETHI ,  Samuel F. Yana Motta ,  Elizabet del Carmen Vera Becerra ,  Yang Zou ,  Henna Tangri ,  Gregory L. Smith

    IPC: C09K5/04

    Abstract: Disclosed are methods for providing heating and/or cooling of the type comprising evaporating refrigerant liquid and condensing refrigerant vapor in a plurality of repeating cycles, where the method comprises (a) providing the refrigerant comprising at least about 5% by weight of a lower alkyl iodofluorocarbon; and (b) exposing at least a portion of said refrigerant in at least a portion of said plurality of said cycles to a sequestration material comprising: i) copper or a copper alloy; ii) a molecular sieve (preferably a zeolite), comprising copper, silver, lead or a combination thereof; iii) an anion exchange resin, and iv) a combination of two or more of these, wherein said exposing temperature is preferably above about 20 C.

    Heat transfer methods, systems and compositions
    7.
    发明授权
    Heat transfer methods, systems and compositions 有权

    公开(公告)号：US11008494B2

    公开(公告)日：2021-05-18

    申请号：US16135962

    申请日：2018-09-19

    Applicant: HONEYWELL INTERNATIONAL INC.

    Inventor： Ankit Sethi ,  Samuel F. Yana Motta ,  Elizabet del Carmen Vera Becerra ,  Yang Zou ,  Henna Tangri ,  Gregory L. Smith

    IPC: C09K5/04

    Abstract: Disclosed are methods for providing heating and/or cooling of the type comprising evaporating refrigerant liquid and condensing refrigerant vapor in a plurality of repeating cycles, where the method comprises (a) providing the refrigerant comprising at least about 5% by weight of a lower alkyl iodofluorocarbon; and (b) exposing at least a portion of said refrigerant in at least a portion of said plurality of said cycles to a sequestration material comprising: i) copper or a copper alloy; ii) a molecular sieve (preferably a zeolite), comprising copper, silver, lead or a combination thereof; iii) an anion exchange resin, and iv) a combination of two or more of these, wherein said exposing temperature is preferably above about 20 C.

    NON-FLAMMABLE REFRIGERANTS WITH LOW GWP AND SECONDARY REFRIGERANT SYSTEMS INCLUDING SUCH REFRIGERANTS
    9.
    发明申请
    NON-FLAMMABLE REFRIGERANTS WITH LOW GWP AND SECONDARY REFRIGERANT SYSTEMS INCLUDING SUCH REFRIGERANTS 有权

    公开(公告)号：US20250067483A1

    公开(公告)日：2025-02-27

    申请号：US18814488

    申请日：2024-08-24

    Applicant: HONEYWELL INTERNATIONAL INC.

    Inventor： Ankit Sethi ,  Henna Tangri ,  Samuel Yana Motta

    IPC: F25B9/00 ,  C09K5/04 ,  F25B41/30

    Abstract: Non-flammable refrigerants with low GWP and secondary refrigerant systems including such refrigerants are provided. The refrigeration system may contain a high temperature refrigerant circuit with a first refrigerant and a low temperature refrigerant circuit with a second refrigerant, wherein the second refrigerant comprises a blend of R1234ze(Z), R1234ze(E), R1336mzz(E) and optionally R227ea, or a blend of R1234ze(Z) R1234ze(E) R1224yd(Z), and optionally R(227ea). The refrigerant fluids may have one of the following characteristics: (i) a global warming potential (GWP) of less than 150; (ii) an evaporator glide of less than 5.5° C.; (iii) non-flammability according to ASHRAE Standard 34; and/or (iv) a boiling point of less than 6° C.

Patent Agency Ranking