Micro-localisation method and device for an imaging instrument and a measuring apparatus

    公开(公告)号:US10565428B2

    公开(公告)日:2020-02-18

    申请号:US16301615

    申请日:2017-05-15

    Abstract: Disclosed is a micro-localisation device defining a system of spatial coordinates for an imaging instrument. The micro-localisation device includes at least one first zone and a second zone, adjacent to each other, each zone extending spatially over an area of macroscopic size, each zone including an elementary cell or a tiling of a plurality of elementary cells extending over the respective area of the zone, each elementary cell of the first, respectively second, zone including an orientation pattern, a positioning pattern and a periodic spatial pattern, configured to be imaged by an imaging instrument and to determine a position and, respectively an orientation of the imaging instrument in the system of spatial coordinates of the micro-localisation device.

    Method for acquiring and forming a spectrometry image by adapted spatial sampling

    公开(公告)号:US10670458B2

    公开(公告)日:2020-06-02

    申请号:US16091837

    申请日:2017-04-03

    Abstract: Disclosed is a method for acquiring and forming a spectrometry image, including the following steps: a) acquiring an initial structural image of an area of a sample; b) breaking down the initial structural image so as to determine a multi-scale spatial sample of the area of the sample; c) determining a plurality of spectrometry measurement positions in the area of the sample, as a function of the multi-scale spatial sampling determined in step b); d) consecutively, for each spectrometry measurement position determined in step c), positioning the excitation beam and acquiring a spectrometry measurement; and e) reconstructing a spectrometry image point-by-point from the spectrometry measurements acquired in step d).

    Method and instrument for measuring etch depth by differential polarimetric interferometry and glow discharge spectrometry apparatus comprising such a measuring instrument

    公开(公告)号:US10859366B2

    公开(公告)日:2020-12-08

    申请号:US16470061

    申请日:2017-12-14

    Inventor: Simon Richard

    Abstract: Disclosed is a method for measuring etch depth including the following steps: splitting a light beam into a first, and respectively second, incident beam directed towards a first, respectively second, area of a sample exposed to an etching treatment to form a first, and respectively second, reflected beam, recombining the first reflected beam and the second reflected beam to form an interferometric beam; detecting a first, and respectively second, interferometric intensity signal relative to a first, respectively second, polarisation component; calculating a lower envelope function and an upper envelope function of a differential polarimetric interferometry signal; determining an offset function and a normalisation function from the first lower envelope function and the first upper envelope function; and calculating a differential polarimetric interferometry function normalised locally at each time instant.

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