公开(公告)号：US12266617B2

公开(公告)日：2025-04-01

申请号：US17746186

申请日：2022-05-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Nan Zhao ,  Chunghsuan Tsai ,  Shanghsuan Chiang

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065

Abstract: A chip package includes a substrate, a first die, a second die, and a beam structure. The first die and the second die are disposed on a side of the substrate and are electrically connected to the substrate. The beam structure is disposed between the first die and the second die. A first end of the beam structure is stacked with and fixedly connected to a part of the first die, a second end is stacked with and fixedly connected to a part of the second die, and the beam structure is insulated from and connected to the first die and the second die. A thermal expansion coefficient of the beam structure is less than a thermal expansion coefficient of the substrate.