公开(公告)号：US20240008167A1

公开(公告)日：2024-01-04

申请号：US18254737

申请日：2021-11-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lan LI ,  Linfang JIN ,  Jinyan HU

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0206 ,  H05K1/144 ,  H05K2201/042

Abstract: An example heat dissipation apparatus is connected to a heat sink. The example heat dissipation apparatus includes a first circuit board, a second circuit board, a support post, a main heat generation component, and a thermal conductive assembly. The second circuit board is located on a side of the first circuit board, and is spaced from the first circuit board. The support post is connected between the first circuit board and the second circuit board to form an air layer between the first circuit board and the second circuit board. The main heat generation component is mounted on the second circuit board. The thermal conductive assembly is connected between a second thermal conductive layer of the first circuit board and a third thermal conductive layer of the second circuit board.

公开(公告)号：US20210255746A1

公开(公告)日：2021-08-19

申请号：US17261467

申请日：2018-07-20

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jinyan HU ,  Linfang JIN ,  Siyang LI

IPC: G06F3/0482 ,  G06F3/0481 ,  G06F3/0488 ,  H04N5/232 ,  G06F1/3203 ,  G06F1/20

Abstract: An application control method and an electronic device are provided. The method includes: The electronic device displays a first user interface of a first application, where the first user interface has N graphical controls; and the electronic device updates the first user interface if a temperature of the electronic device is less than or equal to a first preset temperature, so that an updated first user interface has less than N graphical controls, where N is a natural number greater than 1. In this manner, when the electronic device has a relatively low temperature, a user may be restricted from using some functions of an application.