公开(公告)号：US20230087724A1

公开(公告)日：2023-03-23

申请号：US17994053

申请日：2022-11-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Boning Huang ,  Wentao Yang ,  Junhe Wang

IPC: H01L23/34 ,  H01L29/739 ,  H01L27/06 ,  H01L23/552 ,  H01L29/417 ,  H01L29/423 ,  H01L23/522 ,  H01L23/528 ,  H01L29/06

Abstract: The technology of this disclosure relates to an IGBT chip integrating a temperature sensor, and relates to the field of power device technologies, to improve accuracy of temperature monitoring of the IGBT chip. The IGBT chip integrating the temperature sensor includes a cell region, an emitter pad, a gate pad, a gate finger structure, a temperature sensing module, and a conductive shielding structure. The emitter pad is electrically connected to emitters of a plurality of IGBT cells. The gate finger structure is connected between the gate pad and gates of the plurality of IGBT cells. The temperature sensing module includes a temperature sensor, an anode pad, a cathode pad, and a metal lead. The temperature sensor and at least a part of the metal lead are located in the gate finger structure and are insulated from the gate finger structure.

公开(公告)号：US11133128B2

公开(公告)日：2021-09-28

申请号：US16022055

申请日：2018-06-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yuping Gong ,  Zhaozheng Hou ,  Junhe Wang

IPC: H01F27/24 ,  H01L23/50 ,  H01F27/02 ,  H01F17/04 ,  H01L25/00 ,  H01F3/14 ,  H01F27/30 ,  H01L23/492 ,  H01L23/498

Abstract: A system in package module assembly is provided, and includes: a substrate, and a chip, an inductor, and an electrical element that are electrically connected to the substrate. The substrate includes a first surface, a second surface opposite to the first surface, and an accommodation groove. The accommodation groove passes through the second surface and the first surface. The inductor includes a magnetic core and an inductive coil. The magnetic core includes a base and a protrusion disposed on an outer surface of the base. The outer surface on which the protrusion is disposed and that is of the base abuts on the second surface. The protrusion is accommodated in the accommodation groove. The inductive coil is disposed in the protrusion. A system in package module and an electronic device are further provided.