公开(公告)号：US11133128B2

公开(公告)日：2021-09-28

申请号：US16022055

申请日：2018-06-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yuping Gong ,  Zhaozheng Hou ,  Junhe Wang

IPC: H01F27/24 ,  H01L23/50 ,  H01F27/02 ,  H01F17/04 ,  H01L25/00 ,  H01F3/14 ,  H01F27/30 ,  H01L23/492 ,  H01L23/498

Abstract: A system in package module assembly is provided, and includes: a substrate, and a chip, an inductor, and an electrical element that are electrically connected to the substrate. The substrate includes a first surface, a second surface opposite to the first surface, and an accommodation groove. The accommodation groove passes through the second surface and the first surface. The inductor includes a magnetic core and an inductive coil. The magnetic core includes a base and a protrusion disposed on an outer surface of the base. The outer surface on which the protrusion is disposed and that is of the base abuts on the second surface. The protrusion is accommodated in the accommodation groove. The inductive coil is disposed in the protrusion. A system in package module and an electronic device are further provided.