公开(公告)号：US12087380B2

公开(公告)日：2024-09-10

申请号：US17894233

申请日：2022-08-24

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Bingwu Ji ,  Xingyi Wang ,  Yunming Zhou ,  Tanfu Zhao ,  Chuhua Hu

IPC: G11C29/52 ,  G11C5/14 ,  G11C29/02

CPC classification number: G11C29/025 ,  G11C5/14 ,  G11C29/52

Abstract: This application provides a memory, a chip, and a method for storing repair information of the memory. The memory includes a repair circuit that is configured to receive a first signal from a processor and determine to be powered by a first power supply or a second power supply based on a status of the first signal, to store repair information. The repair information is information of the failed bit cells in the memory. The first power supply is zero or in a high impedance state when a system is powered off, and the second power supply is not zero when the system is powered off. The memory further comprises a processing circuit configured to perform communication between the memory and the processor based on the repair information. Therefore, the repair information of the memory can be stored even during power loss.