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1.发明申请POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNS, AND ELECTRONIC PARTS 有权阳性型感光树脂组合物，生产图案的方法和电子部件公开(公告)号：US20100227126A1
公开(公告)日：2010-09-09
申请号：US12377419
申请日：2006-08-14
申请人： Hajime Nakano , Noriyuki Yamazaki , Yoshiko Futagawa , Yoshika Satou , Dai Kawasaki , Takumi Ueno
发明人： Hajime Nakano , Noriyuki Yamazaki , Yoshiko Futagawa , Yoshika Satou , Dai Kawasaki , Takumi Ueno
CPC分类号： G03F7/0392 , G03F7/0233 , G03F7/085 , G03F7/11 , Y10T428/24802
摘要： A positive-type photosensitive resin composition for electronic materials having good film adhesiveness and sensitivity without causing a corrosion reaction to copper and copper alloys in metal wirings, a method for producing patterns and electronic parts are provided. The positive-type photosensitive resin composition includes (A) a polybenzoxazole precursor having a structure represented by the following general formula (I): wherein X represents a bivalent organic group, Y represents a tetravalent organic group, R1 represents a hydrogen atom or a monovalent organic group, and m represents an integer of 2 to 500 which represents a repeating unit number of the polymer, (B) a solvent, (C) a tetrazole derivative and (D) a compound which generates an acid by light.
摘要翻译： 提供了一种具有良好的膜粘附性和灵敏度的不会对金属布线中的铜和铜合金产生腐蚀反应的电子材料的正型感光性树脂组合物，制造图案和电子部件的方法。 正型感光性树脂组合物包括（A）具有以下通式（I）所示结构的聚苯并恶唑前体：其中X表示二价有机基团，Y表示四价有机基团，R 1表示氢原子或一价 有机基团，m表示2〜500的整数，表示聚合物的重复单元数，（B）溶剂，（C）四唑衍生物和（D）通过光产生酸的化合物。
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2.发明授权Positive-type photosensitive resin composition, method for producing patterns, and electronic parts 有权正型感光性树脂组合物，图案的制造方法和电子部件公开(公告)号：US08097386B2
公开(公告)日：2012-01-17
申请号：US12377419
申请日：2006-08-14
申请人： Hajime Nakano , Noriyuki Yamazaki , Yoshiko Futagawa , Yoshika Satou , Dai Kawasaki , Takumi Ueno
发明人： Hajime Nakano , Noriyuki Yamazaki , Yoshiko Futagawa , Yoshika Satou , Dai Kawasaki , Takumi Ueno
CPC分类号： G03F7/0392 , G03F7/0233 , G03F7/085 , G03F7/11 , Y10T428/24802
摘要： A positive-type photosensitive resin composition for electronic materials having good film adhesiveness and sensitivity without causing a corrosion reaction to copper and copper alloys in metal wirings, a method for producing patterns and electronic parts are provided. The positive-type photosensitive resin composition includes (A) a polybenzoxazole precursor having a structure represented by the following general formula (I): wherein X represents a bivalent organic group, Y represents a tetravalent organic group, R1 represents a hydrogen atom or a monovalent organic group, and m represents an integer of 2 to 500 which represents a repeating unit number of the polymer, (B) a solvent, (C) a tetrazole derivative and (D) a compound which generates an acid by light.
摘要翻译： 提供了一种具有良好的膜粘附性和灵敏度的不会对金属布线中的铜和铜合金产生腐蚀反应的电子材料的正型感光性树脂组合物，制造图案和电子部件的方法。 正型感光性树脂组合物包括（A）具有以下通式（I）所示结构的聚苯并恶唑前体：其中X表示二价有机基团，Y表示四价有机基团，R 1表示氢原子或一价 有机基团，m表示2〜500的整数，表示聚合物的重复单元数，（B）溶剂，（C）四唑衍生物和（D）通过光产生酸的化合物。
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