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公开(公告)号：US20190124760A1
公开(公告)日：2019-04-25
申请号：US15788862
申请日：2017-10-20
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , James A. Gosse , Shun-Tien Lin , Michael Maynard , An Nguyen
Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.
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公开(公告)号：US10306751B2
公开(公告)日：2019-05-28
申请号：US15788862
申请日：2017-10-20
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , James A. Gosse , Shun-Tien Lin , Michael Maynard , An Nguyen
Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.
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