公开(公告)号：US10306751B2

公开(公告)日：2019-05-28

申请号：US15788862

申请日：2017-10-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Jason C. Duffy ,  James A. Gosse ,  Shun-Tien Lin ,  Michael Maynard ,  An Nguyen

IPC: H05K5/00 ,  H05K1/02 ,  H01R12/71 ,  H05K1/18 ,  H05K1/14

Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.

公开(公告)号：US20150098190A1

公开(公告)日：2015-04-09

申请号：US13912808

申请日：2013-06-07

Applicant: Hamilton Sundstrand Corporation

Inventor： Luke T. Orsini ,  Charles V. DeSantis ,  Shun-Tien Lin ,  Kerry R. Querns ,  Kenneth J. Trotman ,  David Perley

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20418 ,  G06F1/20 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/433 ,  H01L23/4338 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2924/0002 ,  H05K7/20509 ,  Y10T29/49826 ,  Y10T29/49963 ,  H01L2924/00

Abstract: Embodiments are directed to an apparatus comprising a thermal block coupled to an electronic device, a thermal strap coupled to the thermal block, and retention hardware coupled to the thermal strap and configured to retain the thermal block within the thermal strap when the apparatus is exposed to at least one variable environmental condition.

Abstract translation: 实施例涉及一种装置，其包括耦合到电子设备的热块，耦合到热块的热带，以及耦合到热带的保持硬件，并且被配置为当该装置暴露于热带时将热块保持在热带内 至少一个可变环境条件。

公开(公告)号：US20190124760A1

公开(公告)日：2019-04-25

申请号：US15788862

申请日：2017-10-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Jason C. Duffy ,  James A. Gosse ,  Shun-Tien Lin ,  Michael Maynard ,  An Nguyen

IPC: H05K1/02 ,  H01R12/71 ,  H05K1/18 ,  H05K1/14

Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.